Fujifilm Corporation

Yusuke Hatanaka

Yoshinori Hotta

Tadabumi Tomita

Akio Uesugi

Tetsu Miyoshi

Satoshi Hoshi

Shinya Suzuki

Naohiro Matsunaga

Atsushi Matsuura

Naoki Koito

Mitsumasa Hamano

Takeshi Hama

Takashi Touma

AKi Nakamichi

Akito Fukunaga

Aki Nakamichi

Provided are a film-forming composition containing a hydrolysate of a siloxane compound represented by Formula (1), silica particles, a ketone-based solvent, and water, and a manufacturing method of a laminate. In Formula (1), R, R, R, and Reach independently represent a monovalent organic group having 1 to 6 carbon atoms. n represents an integer of 2 to 20. 

Film-forming composition and manufacturing method of laminate

Provided are an antibacterial liquid having excellent sedimentation resistance, an antibacterial film formed using the antibacterial liquid, and a wet wipe produced using the antibacterial liquid. The antibacterial liquid is an antibacterial liquid including antibacterial microparticles, a binder, and a solvent, in which the antibacterial microparticles contain a silver-supporting inorganic oxide, the average particle size of the antibacterial microparticles is 1.0 &#x3bc;m or less, the binder includes at least one silane compound, the solvent includes an alcohol and water, and the content of the alcohol with respect to the total mass of the antibacterial liquid is 10% by mass or more.

Antibacterial liquid, antibacterial film, and wet wipe

Provided is an electroacoustic converter film including thin film electrodes provided on both surfaces of a polymeric composite piezoelectric body in which piezoelectric body particles are dispersed in a viscoelastic matrix formed of a polymer material that exhibits viscoelasticity at normal temperature, and protective layers formed on the thin film electrodes. The electroacoustic converter film further includes electrode lead-out metal foils laminated on the thin film electrodes, and the electrode lead-out metal foils allows connection to wiring through soldering when electrodes are led out from the thin film electrodes.

Electroacoustic converter film

Disclosed is an electroacoustic transduction film suitable for a flexible speaker or the like, in which predetermined acoustic properties are able to be stably exhibited regardless of a bending state. The electroacoustic transduction film includes a polymer composite piezoelectric body in which piezoelectric body particles are dispersed in a viscoelastic matrix formed of a polymer material having viscoelasticity at a normal temperature, and electrode layers interposing the polymer composite piezoelectric body therebetween, and an area fraction of the piezoelectric body particles in a contact surface with respect to the electrode layer is less than or equal to 50%, and thus the object is attained.

Electroacoustic transduction film

The purpose of this invention is to provide an aluminum base for a current collector, which enables the production of a secondary battery having excellent cycle properties; and a current collector, a positive electrode, a negative electrode and a secondary battery, each of which is produced using the aluminum base. The aluminum base for a current collector has a surface in which at least two structures selected from the group consisting of a large-wave structure having an average opening size of more than 5 &#x3bc;m but up to 100 &#x3bc;m, a medium-wave structure having an average opening size of more than 0.5 &#x3bc;m but up to 5 &#x3bc;m, and a small-wave structure having an average opening size of more than 0.01 &#x3bc;m but up to 0.5 &#x3bc;m are superimposed on one another, wherein a maximum peak-to-valley height Pt of a profile curve of the surface is up to 10 &#x3bc;m.

Aluminum base for current collector, current collector, positive electrode, negative electrode, and secondary battery

An anisotropic conductive member is connected to a rigid circuit board having a first electrode and a flexible circuit board having a second electrode as a land. A plurality of conductive paths penetrate an insulating base material of the anisotropic conductive member. Each conductive path has a first protrusion and a second protrusion on respective first and second surfaces of the insulating base. The height of the second protrusion is equal to or less than double the thickness of the land. The first protrusion contacts a part of the first electrode. The second protrusion contacts part of the land. The base of the anisotropic conductive member is pressed such that the insulating material is not in direct contact with the flexible circuit board. When attaching the boards, a pressure of 300 MPa to 1,000 MPa is applied to the surfaces of the lands to reduce circuit board breakage.

Structure having circuit boards connected therein and method for connecting circuit boards

Provided is an anisotropically conductive member that has a dramatically increased density of disposed conductive paths, can be used as an electrically connecting member or inspection connector for electronic components such as semiconductor devices even today when still higher levels of integration have been achieved, and has excellent flexibility. The anisotropically conductive member includes an insulating base and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in the thickness direction of the insulating base, one end of each of the conductive paths protruded on one side of the insulating base, the other end of each of the conductive paths exposed or protruded on the other side thereof. The insulating base is made of a resin material and the conductive paths are formed at a density of at least 1,000,000 conductive paths/mm.

Anisotropically conductive member and method for producing the same

An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mmand the insulating base material is a structure composed of an anodized aluminum film having micropores therein.

Anisotropically conductive member and method of manufacture

An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re). The package is characterized in that: the anisotropic conductive film has an insulating base and conductive paths composed of conductive members, insulated from one another, and extending through the insulating base in the direction of the thickness of the insulating base, one ends of the conductive paths are exposed from one side of the insulating base, the other ends are exposed from the other side, the density of the conductive paths is 3,000,000 pieces/mmor more, the insulating base is a structural body composed of an anodic oxide film of an aluminum substrate having micropores, and each micropore does not have a branch structure along the depth. The package can be used as an anisotropic conductive member of an electronic component of a semiconductor device or the like or a connector for inspection even if the structure has a much higher degree of integration realized by drastically improving the installation density of the conductive paths.

Anisotropic conductive joint package

A method of cross-flow filtration using a membrane filter has a feeding a fluid to be filtered across a membrane surface of a porous alumina membrane filter serving as the membrane filter so that the fluid flows parallel to the membrane surface to separate material to be filtered with the porous alumina membrane filter. The porous alumina membrane filter is made of an aluminum anodized film and includes micropores having a degree of ordering as defined by formula (1):Degree of ordering (%)=&#xd7;100&#x2003;&#x2003;(1)of at least 50%, a porosity as defined by formula (2):Porosity (%)=&#xd7;100&#x2003;&#x2003;(2)of at least 40%, and a percentage of a pore size standard deviation to an average pore size of up to 10%.

Cross-flow filtration method and cross-flow filtration device

A microstructure that comprises an insulating base material having through micropores filled with metal at a high filling ratio and that can be used as an anisotropically conductive member is provided. The microstructure comprises an insulating base material having through micropores with a pore size of from 10 to 500 nm at a density of from 1&#xd7;10to 1&#xd7;10pores/mm, a metal being filled into the through micropores at a filling ratio of at least 80%.

Microstructure and method of manufacturing the same

Disclosed is a microstructure comprising an aluminum anodized film bearing through micropores, wherein a surface of the microstructure is covered with a protective film for preventing hydration of the aluminum anodized film. The microstructure may be used as a porous alumina membrane filter excellent in filtration rate and its stability with time.

A microstructure includes an anodized aluminum layer that has on a surface thereof micropores, at least some of which contain a catalyst, in a micropore array with a degree of ordering of at least 40%. A method of manufacturing the microstructure includes anodizing an aluminum member to form on its surface an anodized layer having micropores, removing the aluminum member, and supporting a catalyst on at least part of the anodized layer. The microstructure is excellent in heat resistance.

A method of manufacturing a microstructure wherein an aluminum member having an aluminum substrate and a micropore-bearing anodized film present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving the anodized film until a barrier layer has a thickness of 3 to 50 nm, and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized film so that a ratio of a diameter of a micropore opening 'a' to a micropore diameter at a height 'a/2' from a micropore bottom &#x201c;b&#x201d; (a/b) is in a range of 0.9 to 1.1, whereby the microstructure having micropores formed on a surface thereof is obtained. The manufacturing method enables microstructures having an ordered array of pits to be obtained in a short period of time.

Disclosed is a method of manufacturing a microstructure, wherein an aluminum substrate is subjected to, in order, (1) a step of subjecting a surface of the aluminum substrate to a first anodizing treatment to form an anodized film having micropores on the surface of the aluminum substrate; (2) a step of partially dissolving the anodized film using an acid or alkali; (3) a step of performing a second anodizing treatment to grow the micropores in their depth direction; and (4) a step of removing a part of the anodized film above inflection points in cross section of the micropores, whereby the microstructure having the micropores formed at a surface of the anodized film is obtained and a microstructure manufactured by the method. The method is capable of obtaining in a short period of time a microstructure having an ordered array of pits without using highly toxic chromic (VI) acid.

Growing community of inventors

Haibara-gun, Japan

Yusuke Hatanaka