Diversified Chemical Technologies, Inc.

Yushin Ahn

Rajan Eadara

Joribeth E Joseff

Roy Jacob

Mooil Chung

David Wen-Lung Chang

Biju Philip

Jori Joseff

Sunny K George

Patrick A Ohaka

A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.

Two component, curable, hot melt adhesive

The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.

Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates

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Farmington Hills, MI, United States of America

Yushin Ahn