Sumitomo Bakelite Company Limited

Nec Corporation

Yushi Sakamoto

Toshiro Takeda

Toshio Suzuki

Takeshi Hosomi

Setsuo Suzuki

Satoru Katsurayama

Mitsuo Sugino

Kenichi Kaneda

Katsushi Terajima

Yoshitaka Okugawa

Takuya Tochimoto

Tatsuhiro Yoshida

Sueo Morishige

Takashi Suzuki

Masaya Koda

Koji Morishita

An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mm&#x3c6; and at most 5 gf/5 mm&#x3c6;, and the melt viscosity at 130&#xb0; C. is at least 0.01 Pa&#xb7;s and at most 1.0 Pa&#xb7;s; a preapplied encapsulated component and semiconductor device using the composition, and a process of fabrication thereof. The resin composition is less susceptible to air entrapment during provisional placement of semiconductor chips, and excels in workability and reliability.

Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same

A semiconductor devicehas a BGA substrate, a semiconductor chip, a bumpand an underfillfilling the periphery of the bump. An interlayer dielectricin the semiconductor chipcontains a low dielectric constant film. The bumpis comprised of a lead-free solder. The underfillis comprised of a resin material having an elastic modulus of 150 MPa to 800 MPa both inclusive, and a linear expansion coefficient of the BGA substratein an in-plane direction of the substrate is less than 14 ppm/&#xb0; C.

Semiconductor device

A liquid potting composition, a semiconductor device manufactured using such composition and a process for manufacturing a semiconductor device using such composition. The liquid potting composition comprises: (a) a liquid epoxy resin; (b) a hardener comprising a multi-hydroxy aromatic compound containing at least two hydroxy groups and at least one carboxyl group; and (c) an accelerator. Suitable hardening agents include 2,3-dihydroxybenzoic acid; 2,4-dihydroxybenzoic acid; 2,5-dihydroxybenzoic acid; 3,4-dihydroxybenzoic acid; gallic acid; 1,4-dihydroxy-2-naphthoic acid; 3,5-dihydroxy-2-naphthoic acid; phenolphthaline; diphenolic acid and mixtures thereof.

Liquid potting composition

The object of the present invention is to provide a paste for bonding a semiconductor, which has excellent low stress and excellent heat conductivity and is useful industrially. The object has been achieved by a heat-conductive paste comprising (A) an epoxy resin which is liquid at room temperature and which has at least two epoxy groups in the molecule, (B) an epoxy group-containing reactive diluent having a viscosity of 100 cp or less at room temperature, (C) a phenolic compound as a curing agent represented by the following general formula (1), which is crystalline at room temperature: ##STR1## wherein R is hydrogen atom or an alkyl group of 1-5 carbon atoms, and (D) a silver powder, wherein the amount of the silver powder (D) is 70-90% by weight of the total paste; the silver powder (D) contains an atomized silver powder consisting of flake-shaped particles having longitudinal lengths ranging from 10.mu. to 50.mu. and thicknesses ranging from 1.mu. to 5.mu., in an amount of at least 30% by weight of the total silver powder; and the paste is produced by first melt-mixing the component (C) with the components (A) and (B) or with the component (B), and then kneading the resulting mixture with the component (D) or with the components (D) and (A).

Heat-conductive paste

Film adhesive and process for production thereof

A resin paste for tight sealing, comprising

Resin paste for tight sealing

A process for producing a substrate for optical recording medium (optical disk recording medium), which comprises coating at least one inner surface of a casting mold with a radiation-curable or thermosetting resin, curing the resin to form a coating film on the mold surface or surfaces, casting into the mold an epoxy resin composition comprising an alicyclic epoxy resin or a mixture of an alicyclic epoxy resin and an aromatic epoxy resin, an organic polybasic acid anhydride, a curing accelerator and an anti-discoloring (anti-oxidative) agent, curing the epoxy resin composition to transfer the coating film of the mold to the surface of the cured product of the epoxy resin composition, thereby forming a double or triple layer cast laminate. The above casting mold may have a mold-releasing film on the inner surfaces and the coating film may be formed on this mold-releasing film.

Process for producing substrate for optical recording medium

Growing community of inventors

Tokyo, Japan

Yushi Sakamoto