Kabushiki Kaisha Toshiba

Yusaku Konno

Naotada Okada

Koichi Kokubun

Makoto Kaneko

Yuichiro Yamazaki

Takayuki Ogasahara

Katsuo Iwata

Moto Yabuki

Shinichi Imai

Kazufumi Shiozawa

Minoru Inomoto

Kiminori Yoshino

Yusuke Iida

Mitsutoshi Watabiki

Yusuke Ilda

In accordance with an embodiment, a pattern inspection method includes applying a light to a substrate including an inspection target pattern in a plurality of optical conditions, detecting a reflected light from the substrate to acquire a pattern image for each of the optical conditions, outputting a gray value difference between the pattern image and a reference image for each of the optical conditions, and specifying a position of the defect in a stacking direction of the stacked film from a relation of the obtained gray value difference between the optical conditions. The pattern is formed by a stacked film, the optical conditions includes at least a first optical condition for detection of a defect on a surface of the stacked film.

Pattern inspection method and pattern inspection apparatus

According to one embodiment, a solid-state imaging device includes a first structure part, a second structure part, and a third structure part. The first structure part includes a first insulating body and a first photoelectric conversion part. The first photoelectric conversion part is periodically disposed in the first insulating body and selectively absorbs light in the first wavelength band. The second structure part includes a second insulating body and a second photoelectric conversion part. The second photoelectric conversion part is periodically disposed in the second insulating body and selectively absorbs light in the second wavelength band. The third structure part includes a third photoelectric conversion part. The third photoelectric conversion part absorbs light in a third wavelength band. When viewed in the light incidence direction, the first photoelectric conversion part, the second photoelectric conversion part, and the third photoelectric conversion part are disposed in this order.

Solid-state imaging device

According to one embodiment, there is provided a solid-state imaging device including a first photoelectric conversion layer and a color filter. The color filter includes a multi-layer interference filter and a guided mode resonant grating. The guided mode resonant grating includes a plurality of diffraction gratings and a plurality of inter-grating regions. The plurality of diffraction gratings are formed of a material having a first index of refraction and periodically arrayed at least one-dimensionally. The plurality of inter-grating regions are arranged between at least the plurality of diffraction gratings. Each of the plurality of inter-grating regions includes an insulating film region and an air gap region. The insulating film region is formed of a material having a second index of refraction lower than the first index of refraction.

Solid-state imaging device and manufacturing method of solid-state imaging device

An optical module comprises an apodizer includes a black resin layer having a concavity the diameter of which gradually changes in a direction light passes through the apodizer, and, provided in the concavity, a transparent resin layer having the same refractive index as the black resin layer, the black resin layer and the transparent resin layer having a total thickness of 0.001 to 0.10 mm, an input lens opposed to the black resin layer of the apodizer and an output lens opposed to the transparent resin layer of the apodizer.

Method of manufacturing an apodizer, and optical module

According to one embodiment, a solid-state imaging element includes a substrate, and a plurality of color filters. A plurality of photoelectric conversion units is provided in the substrate. The plurality of color filters is provided respectively for the plurality of photoelectric conversion units. The plurality of color filters is configured to selectively transmit light of a designated wavelength band. Each of the plurality of color filters includes a stacked structure unit and a periodic structure unit. A plurality of layers having different refractive indexes is stacked in the stacked structure unit. A plurality of components is provided in the periodic structure unit at different periods according to the designated wavelength band and an incident angle of the light.

Solid-state imaging element

According to one embodiment, there is provided a solid-state image sensor including a photoelectric conversion layer, and a multilayer interference filter. The multilayer interference filter is arranged to conduct light of a particular color, of incident light, selectively to the photoelectric conversion layer. The multilayer interference filter has a laminate structure in which a first layer having a first refraction index and a second layer having a second refraction index are repeatedly laminated, and a third layer which is in contact with a lower surface of the laminate structure and has a third refraction index. A lowermost layer of the laminate structure is the second layer. The third refraction index is not equal to the first refraction index and is higher than the second refraction index.

Solid-state image sensor

A solid-state imaging device includes: a substrate including a plurality of light receiving sections; and a color filter including a guided-mode resonant grating provided immediately above each of the plurality of light receiving sections, at least one of an upper surface and a lower surface of the guided-mode resonant grating being covered with a layer having a lower refractive index than the guided-mode resonant grating.

In accordance with an embodiment, a pattern inspection method includes: applying a light generated from a light source to the same region of a substrate in which an inspection target pattern is formed; guiding, imaging and then detecting a reflected light from the substrate, and acquiring a detection signal for each of a plurality of different wavelengths; and adding the detection signals of the different wavelengths in association with an incident position of an imaging surface to generate added image data including information on a wavelength and signal intensity, judging, by the added image data, whether the inspection target pattern has any defect, and when judging that the inspection target pattern has a defect, detecting the position of the defect in a direction perpendicular to the substrate.

Pattern inspection apparatus and pattern inspection method

A solid-state imaging device includes: a substrate including a plurality of light receiving sections; an optical waveguide provided above each of the plurality of light receiving sections and surrounded by a cladding layer; a color filter provided above each of the optical waveguides; and a lens provided above the color filter, the optical waveguide including a first layer having a first refractive index and a second layer being in contact with the first layer and having a second refractive index higher than the first refractive index.

Solid-state imaging device and method for manufacturing same

According to one embodiment, a pattern inspection apparatus includes a light source, a beam splitter, a first optical system, a second optical system, a controller, a phase controller and a detector. The beam splitter splits an emitted light into first and second optical paths. The first optical system delivers the light to a first pattern and delivers a first reflected light from the first pattern. The second optical system delivers the light to a second pattern and delivers a second reflected light from the second pattern. The controller is provided on the optical path, and intensities of the first and second reflected lights are substantially equal. The phase controller is provided on the optical path, and phases of the first and second reflected lights are inverted. In addition, the detector detects a light that the first and second reflected lights are made to interfere with each other.

An array-type light receiving device includes a first light collector, a second light collector configured to receive light collected by the first light collector, and a light receiver configured to receive light collected by the second light collector. The first light collector has a spherical shape, the second light collector has a high refractive index portion and a low refractive index portion, and the high refractive index portion has one of a cylindrical shape and a polygonal prismatic shape.

Growing community of inventors

Kanagawa-ken, Japan

Yusaku Konno