Renesas Electronics Corporation

Hitachi, Ltd.

Renesas Technology Corp.

Hitachi Automotive Systems, Ltd.

Hitachi Astemo Ltd.

Hitachi Media Electronics Co., Ltd.

Renesas Mobile Corporation

Yusaku Katsube

Yutaka Igarashi

Akio Yamamoto

Takuma Nishimoto

Masaaki Yamada

Junichi Takahashi

Hiroki Funato

Fusanori Nishikimi

Shinya Kajiyama

Kengo Imagawa

Youhei Nishizawa

Aya Ohmae

Toshihito Habuka

Koichi Terui

Yoshikazu Sugiyama

Fumihito Yamaguchi

Hideyuki Sakamoto

Tatsuo Nakagawa

Yohei Nakamura

Takahide Terada

Ayumu Hatanaka

Kenichi Shibata

Isao Hoda

Yasuyuki Okuma

Toru Yazaki

Satoshi Adachi

Yutaka Okubo

Taku Takaki

Akihiro Goto

Isao Houda

Isao Ikuta

Shoho Ishikawa

Yoko Ohkubo

Kentaro Yamanaka

Masayuki Kawabata

Masazumi Tone

Kosuke Tsuiji

Provided is a power converter that allows a reduction in EMC noise current flowing through a control circuit board. A power converterincludes a semiconductor module, a capacitor, a control circuit board, positive and negative-side bus barsconnecting the semiconductor moduleand the capacitor, a baseelectrically connected to a ground of the control circuit board, the control circuit boardbeing placed on the base, and an electrical conductorelectrically connected to the baseand extending in a stacking direction in which the baseand the control circuit boardare stacked. The positive and negative-side bus barsextend around the electrical conductorand are connected to the semiconductor module

Power converter

Since inductance due to wiring to a Y capacitor is large, it is necessary to arrange the Y capacitor near a bus bar, and there is no degree of freedom in arranging the Y capacitor. Directions of currents flowing through a positive electrode side wiringand a negative electrode side wiringin a multi-core cableare a directionfrom a bus bar positive electrode terminaltoward the Y capacitor positive electrode terminal, and a directionfrom a bus bar negative electrode terminaltoward the Y capacitor negative electrode terminal, respectively. On the other hand, a direction of a current flowing through a ground wiringis a directionfrom a Y capacitor ground terminaltoward a ground terminal. A magnetic flux generated by the currents flowing through the positive electrode side wiringand the negative electrode side wiringin the multi-core cableand a magnetic flux generated by the current flowing through the ground wiringin the multi-core cablecancel each other out, and the inductance can be kept small.

Filter device and power converter

A high voltage filter includes an anode bus bar, a cathode bus bar, a first capacitive element connected between the anode bus bar and a ground connector connected to a ground, a second capacitive element connected between the cathode bus bar and the ground connector, and a third capacitive element connected between the anode bus bar and the cathode bus bar. An anode terminal of the first capacitive element and a cathode terminal of the third capacitive element are arranged adjacent to each other, and a cathode terminal of the second capacitive element and an anode terminal of the third capacitive element are arranged adjacent to each other.

High voltage filter and power conversion device

The inductance of a noise filter circuit is reduced, and an output is increased, whereby positive and negative electrode power supply side conductors each include a first and second conductor portions having a side surface and a main surface having an area larger than an area of the side surface. The first conductor portions are arranged on one surface of a base portion with an insulating member interposed therebetween. The second conductor portions penetrate through a core member in a state in which the main surfaces face each other. A width of a portion of the first conductor portion which is in contact with the insulating member in a direction perpendicular to current flow direction is larger than a width of a portion of the second conductor portion which is disposed within the core member in the direction perpendicular to current flow direction.

Power conversion device

To obtain, in an on-board control device, a shield effect against noise radiated from an electronic component. The present invention includes: an electronic component; a metal housingwhich covers at least a part of the electronic component; a metal portionwhich is provided so that the electronic componentis disposed between the metal portionand the metal housing; and a shield structure which shields radiation noise from the electronic componentby electrostatic capacitive coupling formed between the metal portionand the metal housing

Electronic control device

An ultrasound diagnosis device includes: an ultrasound probe which transmits an ultrasound wave toward a examinee and receives a reflected wave from the examinee; and a main device which controls the transmitting and receiving of the ultrasound waves from the ultrasound probe and is operated to receive a receiving signal obtained by receiving the reflected wave from the examinee by the ultrasound probe, to generate an ultrasound image of the examinee, and to display the ultrasound image on a display screen, wherein the ultrasound probe includes a plurality of subarrays having a plurality of element circuits transmitting and receiving ultrasound signals and a plurality of reference voltage sources, and the plurality of subarrays and the plurality of reference voltage sources have a one-to-one correspondence.

Ultrasound probe and ultrasound diagnosis device using the same

Provided are an ultrasound probe, an element circuit thereof, and an ultrasound diagnostic device, whereby high image quality is possible and reduced size and lower cost are made possible. Provided is an ultrasound probe, comprising: a 2-D array transducer wherein a plurality of transducers are arrayed two-dimensionally; and a 2-D array IC in which are formed, upon an IC substrate, drive circuits which are disposed upon each of the transducers of the 2-D array transducer to drive each of the transducers at different timings with a prescribed delay quantity, and common current sources which supply drive current to the transducers of the 2-D array transducer. The number n of the common current sources which are formed upon the IC substrate is fewer than the number N of the drive circuits which are formed upon the IC substrate.

Ultrasound probe, element circuit thereof, and ultrasound diagnostic device using same

The electronic control unit ECU includes: a basethat has a bottom surface portionon which a printed circuit boardis mounted and an opening opposed to the bottom surface portion; and a coverthat covers at least a part of the bottom surface portionand is engaged with the base. Here, the coverincludes an overlap portionthat is spaced apart from and opposed to a side surfaceof the base, and the overlap portionincludes a slit

Electronic control unit

A test for screening defects of a transmission/reception circuit in an IC is enabled at low cost, without withstand voltage violation, and without carrying out electrical contacts with many terminals connected to oscillators. In a transmission/reception separation switch circuit using transistors as switch elements, a potential of a gate is lowered in a test more than the potential in a case of reception to avoid gate-source withstand-voltage violation when a large-amplitude signal is input, and an internal-signal loopback test is carried out without destroying a reception circuit.

Ultrasonic-wave probe, ultrasonic-wave diagnosis apparatus, and test method of ultrasonic-wave probe

Provided is an ultrasonic probe having an adjustable slew rate, the ultrasonic probe having minimal dimensions and circuit sizes. The ultrasonic probe includes: a transducer; a transmitting circuit; a correcting unit; and a distributing unit. The transmitting circuit includes a transducer driving unit and a current source. The transducer driving unit includes a current mirror of a low voltage transistor and a high voltage transistor. The high voltage transistor is connected to the transducer and the current source supplies an operating current to the low voltage transistor of the transducer driving unit. The correcting unit includes a transmission circuit driving unit replica, a bias unit, and an observing unit. The distributing unit transfers a signal to a current source of the transmitting circuit so that the same current value as the current value extracted by the observing unit flows.

Ultrasonic probe and ultrasonic diagnosis device provided with same

Amplification of a signal by a small circuit size and reduction of a power are achieved. A current controlling current source unitchanges an outputting current based on a transition time setting signal tp. A current controlling current source unitchanges a drawing current based on a transition time setting signal tn. An amplitude control unitchanges a power source voltage supplied to the current controlling current source unitand changes amplitude of a voltage generated by a current outputted from the current controlling current source unit, based on amplitude setting signal ap. An amplitude control unitchanges a power source voltage supplied to the current controlling current source unitand changes amplitude of a voltage generated by the current drawn by the current controlling current source unit, based on amplitude setting signal an. The buffer unitdrives a load in accordance with the current outputted from the current controlling current source unitand the current drawn from the current controlling current source unit

Amplifier circuit and ultrasonic probe

A semiconductor integrated circuit includes a first wireless access system reception unit including a first analog reception unit and a first digital reception unit, a voltage-controlled oscillator, a phase locked loop, and a digital interface. The first analog reception unit comprises a first reception mixer for down-converting an RF reception signal into a first analog reception signal and a first analog-digital converter for converting the first analog reception signal into a first digital reception signal. The first wireless access system reception unit, the voltage-controlled oscillator, and the phase locked loop enable switching from a reception operation for a first RF reception signal of a first system to a reception operation for a second RF reception signal of a second system.

Semiconductor integrated circuit and operating method thereof

A semiconductor integrated circuit includes an operational amplifier that amplifies a voltage difference between an input voltage supplied to an inverting input terminal and a reference voltage supplied to a non-inverting input terminal and outputs an amplified signal, a feedback resistor that performs negative feedback of the amplified signal to the inverting input terminal of the operational amplifier, and a variable resistor unit that sets a current path with a first resistance value in accordance with a control signal between an external input terminal and the inverting input terminal of the operational amplifier, and sets a first alternative path with a second resistance value in accordance with the control signal between a node on the current path and a reference voltage terminal to which the reference voltage is supplied.

Semiconductor integrated circuit and radio communication terminal including the same

A semiconductor integrated circuit includes: a first capacitance element and a second capacitance element; a first amplification circuit that amplifies a potential difference of a first voltage signal and a second voltage signal supplied via the first capacitance element and the second capacitance element, respectively, to output a first amplification signal and a second amplification signal; a first resistance element that feeds back the first amplification signal to one input terminal of the first amplification circuit; a second resistance element that feeds back the second amplification signal to another input terminal of the first amplification circuit; a voltage generator that generates a predetermined voltage; and a third resistance element that transmits the predetermined voltage generated by the voltage generator to each input terminal of the first amplification circuit.

Semiconductor integrated circuit, and reception apparatus and radio communication terminal including semiconductor integrated circuit

The present invention is directed to accurately set a frequency characteristic of a filter integrated in a semiconductor integrated circuit. A semiconductor integrated circuit includes a filter circuit, a cutoff frequency calibration circuit, and a Q-factor calibration circuit. The cutoff frequency calibration circuit adjusts cutoff frequency of the filter circuit to a desired value by adjusting capacitance components of the filter circuit. After adjustment of the cutoff frequency of the filter circuit by the cutoff frequency calibration circuit, the Q-factor calibration circuit adjusts the Q factor of the filter circuit to a desired value by adjusting a resistance component of the filter circuit.

Growing community of inventors

Yokohama, Japan

Yusaku Katsube