Seoul Viosys Co., Ltd.

Yuriy Bilenko

Ki Yon Park

A light-emitting device package includes a substrate having a mounting region in which a light-emitting device chip is mounted. The light-emitting device package further includes a reflector and a cover enclosing the reflector. The reflector is disposed around the light-emitting device chip and having an opening through which the mounting region of the substrate is exposed. The reflector has elasticity to allow variation of a diameter thereof.

Light-emitting device package and manufacturing method therefor

A light emitting element package includes a substrate provided with an interconnect portion, a light emitting element mounted on the substrate and connected to the interconnect portion, and a cover member contacting an upper surface of the light emitting element while covering the light emitting element. The cover member comprises an organic polymer, which can have polymer nodes linked to each other, and has a light transmittance of 85% or more in an ultraviolet wavelength range.

Growing community of inventors

Gyeonggi-do, South Korea

Yuriy Bilenko