Camtek Ltd.

Yuri Postolov

Menachem Regensburger

An inspection system and a method for inspecting a diced wafer. The method includes: acquiring multiple images of multiple portions of the diced wafer according to a predefined image acquisition scheme; locating multiple unique features within the multiple images; and assigning a die index to each die of the multiple dice and associating between the multiple dice and multiple reference dice in response to locations of the multiple unique features and to at least one expected die dimension.

Inspection system and a method for inspecting a diced wafer

A method for inspecting a group of dies of a wafer, wherein the wafer comprises a group of wafer segments, wherein each wafer segment comprises a die of the group of dies, a molded material that surrounds the die and redistribution layer (RDL) conductors that are coupled to the die and are positioned above the die and the molded material, wherein the method includes the steps of: receiving design information about the RDL conductors of each wafer segment of the group of wafer segments; obtaining, during a setup process, first images of the group of wafer segments; wherein the obtaining of the first images comprises illuminating the group of wafer segments with radiation and detecting radiation scattered or reflected from the group of wafer segments as a result of the illuminating; generating reference information based on the design information about the RDL conductors of one or more wafer segments of the group of wafer segments and at least one first image of the one or more first images; acquiring, during an inspection process, a second image of each wafer segment of the group of wafer segments; and evaluating each wafer segment of the group of wafer segments based on the second image of the wafer segment and the reference information of the wafer segment.

Inspecting a wafer using image and design information

A method for inspecting objects and an inspection system, the system includes: an image acquisition unit adapted to acquire multiple images, according to a predefined image acquisition scheme, of multiple portions of a diced wafer that comprises multiple dice; and a processor adapted to locate multiple unique features within the multiple images, at least partially during the acquisition of images; associate multiple unique features with multiple dice, at least partially during the location of multiple unique features; determine multiple transformations between multiple die coordinate systems and a global coordinate system, in response to a locations of unique features and their associations with multiple dice, at least partially during an association between multiple unique features with multiple dice; and detect defects in response to a comparison between dice and corresponding reference dice, in response to the transformations, at least partially during the determination of the multiple transformations.

Inspection system and a method for detecting defects based upon a reference frame

A wafer inspection system and a method for inspecting a wafer. The method includes: acquiring multiple frames that cover a first area that comprises a die and a first surrounding area that surrounds the die; wherein the frames partially overlap to provide overlap areas; and processing a sequence of decomposed images of overlap areas such as to align mutually misaligned frames and generating a die reference image.

A method for inspecting a diced object that comprises multiple dies, the method includes: acquiring multiple images of multiple portions of the diced object, starting from a first portion that comprises an alignment area and continuing through adjacent portions of the diced object; assigning a die index to each die of the multiple dies of the diced object, starting from a die of the first portion and continuing through adjacent portions of the diced object; associating between dies of the diced object and a dies of a reference object in response to the assigned indexes and locations of the dies of the diced object; wherein the reference object is not diced; and comparing between a die of the diced object and another die while taking into account an association between the die of the diced object and a reference object die.

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Afula, Israel

Yuri Postolov