Koki Company Limited

Yuri Misumi

Takeshi Yahagi

Noriyoshi Uchida

Kazuhiro Yukikata

Tatsuya Baba

Motohide Sasaki

Takefumi Arai

Kazuma Karube

A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.

Flux and solder paste

A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.

A flux containing terpene phenolic resin and having an acid value of 120 mgKOH/g or more is provided. The acid value can be 250 mgKOH/g or less. The terpene phenolic resin can be contained by 0.05 mass % or more and 30 mass % or less. The flux can contain the terpene phenolic resin and another resin component as a rosin component, and an amount of the terpene phenolic resin contained in the rosin component can be 0.1 mass % or more and 80 mass % or less.

Growing community of inventors

Tokyo, Japan

Yuri Misumi