National Semiconductor Corporation

Texas Instruments Corporation

Eastman-Kodak Company

Yuri Mirgorodski

Peter J Hopper

Vladislav Vashchenko

Philipp Lindorfer

Saurabh Desai

Natalia Lavrovskaya

Pavel Poplevine

Jeffrey A Babcock

Roozbeh Parsa

Jeff A Babcock

Peter B Johnson

William David French

Andrew J Franklin

Mark Willam Poulter

Erika Lynn Mazotti

Andy Strachan

Andrew Derek Strachan

Alexander H Owens

Douglas Brisbin

Hengyang (James) Lin

David Tsuei

Natasha Layrovskava

Saurahh Desai

Natasha Lavrovskaya

Philip Lindorpher

Vladislav Vashshenco

Chin Miin Shyu

The number of times that a non-volatile memory (NVM) can be programmed and erased is substantially increased by utilizing a localized heating element that anneals the oxide that is damaged by tunneling charge carriers when the NVM is programmed and erased. The program and erase voltages are also reduced when heat from the heating element is applied prior to programming and erasing.

Non-volatile memory cell having a heating element and a substrate-based control gate

A method of simulating an integrated circuit device under test (DUT) is provided, wherein the DUT includes a plurality of terminals. For each terminal of the DUT, a probe pulse is applied to the terminal and a reaction is recorded at the terminal and each of the other terminals to obtain values representative of reactive tails for the terminal. For each terminal, the values representative of the reactive tails obtained for the terminal are stored as an entry of a look-up table. Each entry includes n+x fields, wherein n represents a number of arguments in the entry and x represents a number of functions in the entry. For each terminal, a signal value at a selected time step is calculated.

Black box model for large signal transient integrated circuit simulation

A semiconductor-based gas detector enhances the collection of gas molecules and also provides a self-contained means for removing collected gas molecules by utilizing one or more electric fields to transport the gas molecules to and away from a metallic material that has a high permeability to the gas molecules.

Gas detector that utilizes an electric field to assist in the collection and removal of gas molecules

A method is provided for enhancing charge storage in an EPROM cell structure that includes a read transistor having spaced apart source an drain diffusion regions formed in a semiconductor substrate to define a substrate channel region therebetween, a conductive charge storage element formed over the substrate channel region and separated therefrom by gate dielectric material, a conductive control gate that is separated from the charge storage element by intervening dielectric material, and a conductive heating element disposed in proximity to the charge storage element. The method comprises performing a programming operation that causes charge to be placed on the charge storage element and, during the programming operation, heating the heating element to a temperature such that heat is provided to the charge storage element.

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A method for forming a doped region of a semiconductor device includes masking a portion of a substrate with a mask. The mask is configured to create a graded doping profile within the doped region. The method also includes performing an implant using the mask to create doped areas and undoped areas in the substrate. The method further includes diffusing the doped areas to create the graded doping profile in the doped region. The mask could include a first region having openings distributed throughout a photo-resist material, where the openings vary in size and spacing. The mask could also include a second region having blocks of photo-resist material distributed throughout an open region, where the photo-resist blocks vary in size and spacing. Diffusing the doped areas could include applying a high temperature anneal to smooth the doped and undoped areas to produce a linearly graded doping profile.

Method of forming a region of graded doping concentration in a semiconductor device and related apparatus

A method of reading an NVM cell structure formed on a deep well of N-type semiconductor material, wherein the NVM cell structure includes a PMOS transistor formed in an N-type well, the PMOS transistor including spaced-apart p-type source and drain region defining an n-type cannel region therebetween, an NMOS transistor formed in a P-type well that is adjacent to the N-type well, the NMOS transistor including spaced-apart n-type source and drain regions defining a p-type channel region therebetween, a conductive floating gate that includes a first section that extends over the n-type channel region of the PMOS transistor and is separated therefrom by intervening dielectric material and a second section that extends over the p-type channel region and is separated therefrom by intervening dielectric material, and a conductive control gate formed over at least a portion of the second section of the floating gate and is separated therefrom by intervening dielectric material, the method comprising: biasing the deep N-type well at a preselected read voltage; holding the source region of the PMOS transistor at the read voltage; holding the drain of the PMOS transistor at ground; and holding the control gate at ground for a preselected read time.

Method of reading an NVM cell that utilizes a gated diode

A method of erasing an NVM cell structure formed on a deep well of N-type semiconductor material, wherein the NVM cell structure includes a PMOS transistor formed in an N-type well, the PMOS transistor including spaced-apart p-type source and drain regions defining an n-type channel region therebetween, an NMOS transistor formed in a P-type well that is adjacent to the N-type well, the NMOS transistor including spaced-apart n-type source and rain regions defining a p-type channel region therebetween, a conductive floating gate that includes a first section that extends over the n-type channel region of the PMOS transistor and is separated therefrom by intervening dielectric material and a second section that extends over the p-type channel region and is separated therefrom by intervening dielectric material, and a conductive control gate formed over at least a portion of the second section of the floating gate and separated therefrom by intervening dielectric material, the erasing method comprising: biasing the deep N-type well at a selected erase voltage; holding the source and drain regions of the PMOS transistor at the erase voltage or floating; and holding the control gate at ground for a preselected erase time.

Method of erasing an NVM cell that utilizes a gated diode

Non-volatile memory cell with heating element

In a non-volatile memory cell, a single poly SOI technology is used to save space and achieve low current programming by providing two capacitors formed in an n-material over an NBL, forming a inverter in an n-material over a PBL, and isolating the NBL from the PBL by means of a lightly doped region or a deep trench isolation region.

Non-volatile memory cell with two capacitors and one PNP transistor and a method of forming such a cell in a 1-poly SOI technology

In a programmable circuit making use of fuse cells, a snapback NMOS or NPN transistor or SCR without reversible snapback capability is used as an anti-fuse, and programming comprises biasing the control electrode of the transistor to cause the transistor to go into snapback mode.

Fuse-type memory cells based on irreversible snapback device

A method of operating a non-volatile memory (NVM) cell structure that utilizes gated diode is provided. The cell architecture, utilizing about 4-10 um2 per bit, includes gated diodes that are used to program the cells while consuming low programming current. The cell architecture also allows a large number of cells to be programmed at the same time, thereby reducing the effective programming time per bit. Erase and read mode bias conditions are also provided.

Mid-size NVM cell and array utilizing gated diode for low current programming

In a non-volatile memory cell, charge is stored in a fully isolated substrate or floating bulk that forms a storage capacitor with a first poly strip and includes a second poly strip defining a control gate and a third poly strip coupled to a read transistor gate.

Non-volatile memory cell with fully isolated substrate as charge storage

A heating element is utilized to improve the bias conditions of an EPROM cell during program and erase operations. The heating element can also be used to anneal or condition the cell for improved charge storage. During a program or an erase operation, the cell's control gate and read transistor are set to ground. The heating element then has a voltage potential applied across its terminals, causing current to flow in this resistor. As the current density increases, the resistor begins to generate heat. This heat is thermally coupled into the cell's floating gate, causing its temperature to rise.

Growing community of inventors

Sunnyvale, CA, United States of America

Yuri Mirgorodski