Ruggedcom Inc.

Is5 Communications, Inc.

Siemens Canada Limited

Soliman, Tamer

Luskind, Yuri

Kostya, Belezko

Tseitin, Boris

Yuri Luskind

Guang Zeng

Roger Moore

Phil Levy

Tamer Soliman

Boris Tseitin

Clive Dias

Kostya Belezko

Petru Ovidiu Lupas

Philip Levy

Belezko Kostya

The present invention relates to electronic systems for use in high demand or mission critical environments, including power stations, sub-stations, roadside transportation, rail, and industrial applications. The present invention provides a) increased resilience of mission critical communications infrastructure b) ability to maintain multiple independent RSTP domains over HSR ring d) method of using a hidden VLAN as an RSTP domain ID c) a method of creating multiple redundant protocols domains over HSR ring.

Multiple RSTP domain separation

The present invention relates to an environmentally robust critical infrastructure security framework for network use in high demand or mission critical environments and applications, including but not limited to power stations, sub-stations, intelligent transportation systems (ITS), rail, traffic control systems, chemical, oil & gas, critical manufacturing, and industrial applications is disclosed (e.g. complaint to most advanced industrial and military applications). The present invention provides a simple yet effective method suitable for critical infrastructure operations, their systems and protocol requirements. The framework includes role based access control (RBAC) down to each intelligent electronic device (TED), programmable logic controller (PLC), etc. regardless of the type of the device and without the need to have support at the IED level for specific requirements.

Critical infrastructure security framework

The present invention relates an environmentally robust chassis design for use in high demand or mission critical environments, including power stations, sub-stations, roadside transportation, rail, and industrial applications. The present invention provides a) increased cooling and reliability for the components of electronic equipment, more particularly electronic components, which could affect the power supply, data transmission; and b) increased tolerance to excessive shock and vibration (e.g. can withstand over 20 G of force).

Symmetrical and orthogonal component design

An open frame chassis has a top opening and a bottom opening permitting ambient airflow. A plurality of modules, each enclosing electrical components in thermal contact with a heat sink area of their corresponding module, can each be inserted in the chassis. Ambient air may flow from the bottom opening across the heat sink area of each module to the top opening to passively cool the modules and electrical components. Key pins guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins on corners of the modules mate with guide holes in the chassis to secure the module to the chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules in the end slots of the chassis may be exposed.

Open frame electronic chassis for enclosed modules

A method and device for converting between different time domains at a local unit utilizing an processor is disclosed. Time counters to count time in at least two different formats are located locally at each unit. Once a time conversion is initiated, a time stamp is received by the processor and the time counter in the new time domain commences calculating an adjustment count. Once the converted time is received from the processor, the received time plus the adjustment count are summed to provide a time base for the new time domain. The time counters continue counting in their respective time domains after conversion.

Time format conversion method, device and system

An open frame chassis has a top opening and a bottom opening permitting ambient air flow there through. A plurality of modules, each enclosing electrical components which are in thermal contact with a heat sink area of their corresponding module, and each of which can be inserted to an inserted position in the open frame chassis. When the modules are inserted into the open frame chassis, ambient air may flow from the bottom opening of the chassis across the heat sink area of each module to the top opening in order to passively cool the modules and the electrical components enclosed therein. The heat sink area has fins which are separated by a distance of 9 mm to 12 mm and have a height 10 mm to 20 mm. Key pins are associated with the electrical connectors of the chassis to guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins are present on the corners of the modules to mate with guide holes in the chassis to secure the module to the open frame chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules inserted into the end slots of the chassis may be exposed. The power modules are inserted into the end slots. The chassis has an inverted connection at one end slot to accommodate identical power modules at both end slots such that the heat sink area always faces a side opening in the open frame chassis.

Growing community of inventors

Thornhill, Canada

Yuri Luskind