Huawei Technologies Co., Limited

Yuping Hong

Wei Chen

Yun Tang

Xiaowei Hui

Mingliang Hao

Youhe Ke

Shengqin Ji

Yongchao He

Meng Wang

Hua Yang

Zhen Sun

Jian Shi

Chenglong Wang

Vadim Tsoi

Haipeng Li

Feng Peng

Zhijian Li

Liqian Zhai

Hongliang Chen

Taqing Feng

Xiaoming Kong

Uno Henningsson

Zhen Lu

Youlin Jin

Weixing Wu

Kaixiang Yang

Weixing Su

A heat sink is provided. The heat sink includes a base board and a rib board. The base board includes a base board cavity, and the rib board includes a rib board cavity. The base board includes a first board face and a second board face. A groove is disposed on the second board face. The base board cavity is filled with a liquid working medium. The rib board includes at least one partition board. The at least one partition board separates the rib board cavity into at least two chambers. The at least two chambers are separately connected to the base board cavity. One end of the rib board is inserted in the base board through the groove. One end of the partition board is located in the base board. A communication device that includes the heat sink is also provided.

Heat sink and communication device

A heat dissipation apparatus is provided. The heat dissipation apparatus includes a thermally conductive housing. The heat dissipation apparatus is connectable to a chip so that the chip is arrangeable on a chip placement region of the thermally conductive housing. A capillary structure is disposed on the thermally conductive housing and a working medium is placed in the capillary structure. The capillary structure includes a first capillary structure and a second capillary structure that are connected, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure.

Heat dissipation apparatus, circuit board, and electronic device

A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

Heat sink and communications product

The present invention discloses a communications product (), including a remote radio module () and a mounting kit (), where the mounting kit () includes a fastening part (), the fastening part () is configured to mount and fasten the remote radio module () to a holder, the mounting kit () further includes a ventilation part () and an air supply part (), an air source is disposed inside the air supply part (), the ventilation part () is connected between the fastening part () and the air supply part (), a ventilation channel is disposed inside the ventilation part (), and the ventilation channel allows the air supply part () to communicate with the remote radio module (), so that an air flow generated by the air source reaches the remote radio module () after passing through the ventilation channel, to dissipate heat for the remote radio module.

Communications product and base station system

A communications product, including at least one RRU and a fan assembly, where the fan assembly is independent of the at least one RRU, and is disposed side by side with the at least one RRU, an air duct is disposed between the fan assembly and the RRU, and an airflow passes, from the fan assembly, through the air duct, and arrives at the at least one RRU, to dissipate heat of the at least one RRU. The communications product of the present disclosure can ensure a heat-dissipation capability, and also can allow the RRU to be small in size. The present disclosure further provides a base station system that includes the communications product.

A heat spreading device includes sectioning forming a first chamber portion and a second chamber portion, a first plurality of conduits, and a second at least two conduits. The second at least two conduits interconnect the first chamber portion and the second chamber portion. The heat spreading device may also include cavities, a barrier, and fins.

Heat spreading device and method with sectioning forming multiple chambers

A cabinet temperature control system comprises a cabinet and an underground temperature control unit. The cabinet comprises an air discharging chamber and an air introducing chamber which are in communication with each other inside the cabinet. The underground temperature control unit comprises an air discharging chamber and an air introducing chamber which are in communication with each other inside the underground temperature control unit. The air discharging chamber of the cabinet and the air introducing chamber of the underground temperature control unit, and the air discharging chamber of the underground temperature control unit and the air introducing chamber of the cabinet, are in communication with each other respectively, so that the cabinet and the underground temperature control unit form an air circulating circuit. The underground temperature control unit further comprises a radiator arranged in the air circulating circuit. The system also has fans controlled by a control module.

Cabinet, and cabinet temperature control system

A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (). The substrate () having a surface where a heat absorbing surface () is formed. There are multiple hollow conduits inside the substrate () to act as evaporating conduits (). The heat dissipation device further comprises condensing conduits () intercommunicated with the evaporating conduits (). The evaporating conduits () and the condensing conduits () form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits () are set in the substrate ().

Heat dissipation device and radio frequency module with the same

A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.

Horizontal subrack and communication cabinet

A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct. The air-in duct is located on one side of the board slots, and the air-out duct is located on the other side of the board slots. The air-in duct is linked to the air-in chamber, and the air-out duct is linked to the air-out chamber. The horizontal subrack extends the trail between the fan box and the board area, improves the evenness of the air volume distributed to the slots of the horizontal subrack, and overcomes the bottleneck of enhancing the heat dissipation capability of the horizontal subrack.

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Shenzhen, China

Yuping Hong