Samsung Electronics Co., Ltd.

Kpx Chemical Co., Ltd.

Yunseok Choi

Wonseok Lee

Jeongguk Lee

Seongwook Song

Yukyung Park

Dochang Ahn

Taeyoung Kim

Hoon Hee Han

Sangwoo Lee

Moonyoung Kim

Jinhye Bae

Hyojin Yun

Seungkwan Ryu

Suchang Lee

Minseung Yoon

Soyoung Jeong

Eunkyoung Choi

Yongchul Lee

Jaeseong Yu

Seungwon Kim

Sunghyuk Yim

Woojung Park

Mintae Lee

Hyunseop Shin

Moonchang Kim

Cheolmo Yang

Sungwoo Park

Hoon Huh

Heeseok Lee

Eunyong Kim

Yonghoon Kim

Yongkyu Lee

Hyukjae Jang

Irina Kim

Youngil Seo

Yechung Chung

Woojae Kim

Jongmin You

Ungcheon Kim

Yungjun Kim

Hansol Lee

Hyoyol Park

Sungho Jun

Suhyun Jo

YoungHoon Ro

Jeewoong Kang

Heonwoo Kim

Dongpan Lim

HanShin Youn

Eundoo Heo

In Won O

Youngmin Jeong

Seongwon Jo

Eunseok Lee

Seungri Ju

Jaehyun Sung

A wafer cleaning equipment includes a vessel that includes a first inner wall, a second inner wall that faces the first inner wall, and a bottom connected to the first and second inner walls, a plurality of first nozzles disposed on the first inner wall, a plurality of second nozzles disposed on the second inner wall, a support structure disposed between the plurality of first nozzles and the plurality of second nozzles, where the support structure supports a wafer, and a megasonic cleaner disposed between the bottom of the vessel and the wafer supported by the support structure. The megasonic cleaner includes a rack and at least one vibrator disposed below the rack.

Wafer cleaning equipment

A photoresist-removing composition includes a polar organic solvent, an alkyl ammonium hydroxide, an aliphatic amine not including a hydroxy group, and a monovalent alcohol. To manufacture a semiconductor device, a photoresist pattern may be formed on a substrate, and the photoresist-removing composition may then be applied to the photoresist pattern. To manufacture a semiconductor package, a photoresist pattern including a plurality of via holes may be formed on a substrate. A plurality of conductive posts including a metal may be formed inside the plurality of via holes, and the photoresist pattern may be removed by applying a photoresist-removing composition of the inventive concept to the photoresist pattern. A semiconductor chip may be adhered to the substrate between the respective conductive posts.

Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositions

An image sensor includes a pixel array and a readout circuit that generates a first image of an object based on a first exposure time, a second image of the object based on a second exposure time, and a third image of the object based on a third exposure time, the first exposure time, the second exposure time, and the third exposure time being different from each other and the second exposure time and the third exposure time are shorter than the first exposure time, a pre-processor that performs linearization processing on the second image and the third image to generate a merged image with an increased number of bits of a pixel value, and an interface circuit that outputs first image data based on the first image and second image data based on the merged image to an external processor.

Image sensor processing merged image and image processing system comprising the same

An imaging system includes an image sensor configured to obtain first image data, based on a received light; and a processing circuit configured to determine an operating mode of the image sensor, among a first mode and a second mode, based on an illumination and a dynamic range corresponding to the obtained first image data. The image sensor includes a first sub-pixel configured to sense a target light corresponding to a target color, in the first mode, convert the target light sensed during a first exposure time, into a first signal, and in the second mode, convert the target light sensed during a second exposure time longer than the first exposure time, into a second signal.

Imaging system for generating high dynamic range image

Provided are an image sensor module, an image processing system, and an image compression method. The image compression method of compressing image data generated by an image sensor includes: receiving pixel values of a target pixel group of image data on which compression is to be performed, and reference values of reference pixels to be used in compression of the target pixel group; determining an averaging direction in which an averaging calculation is to be performed on target pixel values; averaging the pixel values of target pixels in the averaging direction; generating balance information including compensation values to be applied to the average values based on the reference pixels; and generating a bitstream based on the average values, the balance information, and compression information.

Image sensor module, image processing system, and image compression method

An interposer includes a base layer including a first surface and a second surface that are opposite to each other. An interconnect structure is disposed on the first surface. The interconnect structure includes a metal interconnect pattern and an insulating layer surrounding the metal interconnect pattern. A first lower protection layer is disposed on the second surface. A plurality of lower conductive pads is disposed on the first lower protection layer. A plurality of through electrodes penetrates the base layer and the first lower protection layer. The plurality of through electrodes electrically connects the metal interconnect pattern of the interconnect structure to the lower conductive pads. At least one of the insulating layer and the first lower protection layer has compressive stress. A thickness of the first lower protection layer is in a range of about 13% to about 30% of a thickness of the insulating layer.

Interposer and semiconductor package including the same

Provided is an image compression method for compressing image data generated by an image sensor, the image compression method including detecting a saturated pixel among a plurality of pixels included in a pixel group included in the image data, the saturated pixel having a pixel value exceeding a threshold value, and the plurality of pixels being adjacent to each other and having a same color as each other, generating a saturation flag indicating a position of the saturated pixel, compressing the image data by comparing a reference pixel with at least one non-saturated pixel among the plurality of pixels included in the pixel group, and outputting a bitstream including the saturation flag, a compression result, and a compression method.

Image compression method using saturated pixel, encoder, and electronic device

A camera module includes a compressor configured to divide a plurality of pixels included in image data, into a plurality of pixel groups, with respect to each of the plurality of pixel groups into which the plurality of pixels is divided, calculate a representative pixel value of a corresponding pixel group, based on pixel values of multiple pixels included in the corresponding pixel group, generate first compressed data, based on the calculated representative pixel value of each of the plurality of pixel groups, with respect to each of the plurality of pixel groups into which the plurality of pixels is divided, calculate residual values representing differences between the pixel values of the multiple pixels included in the corresponding pixel group and the representative pixel value of the corresponding pixel group, and generate second compressed data, based on the calculated residual values of each of the plurality of pixel groups.

Camera module, image processing device and image compression method

A semiconductor package includes a base substrate and an interposer substrate. The interposer substrate includes a semiconductor substrate, a first passivation layer, a wiring region, a through via penetrating through the semiconductor substrate and the first passivation layer, and a second passivation layer covering at least a portion of the first passivation layer and having an opening exposing a lower surface of the through via. The semiconductor package further includes a conductive pillar extending from the opening of the second passivation layer; and a conductive bump disposed between the conductive pillar and the base substrate. The opening of the second passivation layer has inclined side surfaces such that a width of the opening decreases towards the first passivation layer, and side surfaces of the conductive pillar are positioned to overlap the inclined side surfaces of the second passivation layer in a vertical direction.

Semiconductor package

An image processing apparatus includes a camera configured to generate first image data, a pre-processor configured to generate second image data based on performing a pre-processing operation on the first image data, a neural network processor configured to generate third image data based on performing an image processing operation on the second image data based on using a neural network model trained to perform one or more particular image processing operations, and a main processor configured to generate corrected image data based on performing a post-processing operation on the third image data.

Image processing apparatus including neural network processor and method of operating the same

A mobile electronic device includes a first camera configured to capture a first image of a subject in a first field of view and including an RGB array, a second camera configured to capture a second image of the subject in a second field of view that is different from the first field of view and including an RGBW array; and an image processor configured to generate a target image using at least one of the first or second images in accordance with a selected mode of a plurality of modes. The plurality of modes includes still image modes and video modes associated with separate, respective combinations of output speed and bit depth such that the image processor is configured to control an output of the second camera to have a different combination of output speed and bit depth based on the selected mode.

Mobile electronic devices having multi-camera modules

An image compression camera module, an image processing system, and a method of compressing each of a plurality of pixel groups forming image data are provided. The method includes detecting a bad pixel among a plurality of pixels in a pixel group, generating a flag indicating position information about the bad pixel, calculating a first difference between a pixel value of a pixel among the plurality of pixels excluding the bad pixel and a reference pixel value, and generating a bitstream including the flag and the first difference.

Camera module, image processing system and image compression method

An image sensor module, an image processing device, and an image compression method receive pixel values of a target pixel group to be compressed in the image data and reference values of reference pixels to be used for compression of the target pixel group, generate a virtual reference map by applying an offset value to each of the reference values, compress the pixel values of the target pixel group based on the virtual reference map, and generate a bitstream based on a compression result and compression information based on the virtual reference map.

Growing community of inventors

Seoul, South Korea

Yunseok Choi