Samsung Electronics Co., Ltd.

Yunjung Jee

Yusin Yang

Chungsam Jun

Sung Yoon Ryu

Janghee Lee

Younghoon Sohn

Jaehyung Ahn

Wahseng Yap

Joonseo Song

Yoo Jin Jeoung

A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.

Method of inspecting semiconductor wafer, an inspection system for performing the same, and a method of fabricating semiconductor device using the same

Disclosed are apparatuses and methods for measuring a thickness. The apparatus for measuring a thickness including a light source that emits a femto-second laser, an optical coupler through which a portion of the femto-second laser is incident onto a target and other portion of the femto-second laser is incident onto a reference mirror, a detector configured to receive a reflection signal reflected on the reference mirror and a sample signal generated from the target and configured to measure a thickness of the target based on an interference signal between the reflection signal and the sample signal, and a plurality of optical fiber lines configured to connect the light source, the optical coupler, and the detector to each other may be provided.

Apparatus and method for measuring thickness

Growing community of inventors

Seongnam-si, South Korea

Yunjung Jee