Intel Corporation

Agilent Technologies, Inc.

Yunhui Chu

Charles C Phares

James A McCall

Xiang Li

Jun Liao

Jong-Ru Guo

John M Lynch

Kai Xiao

Zuoguo Wu

Xiaoning Ye

John Lang

Jingbo Li

Yanli Zhang

George Vergis

Zhiming Zhuang

Zhen Zhou

Jaejin Lee

Beom-Taek Lee

Konika Ganguly

Mo Liu

Fan Chen

Chunfei Ye

Christian Karl

Derek M Conrow

Beomtaek Lee

Qin Li

Yuanhong Zhao

Zhenwei Yu

Christopher Philip Mozak

James Alexander Mccall

An apparatus comprises a crosstalk cancelation circuit comprising a plurality of taps to output signals based on a signal transmitted via a first data line; and a summation circuit to combine a signal received by a second data line with the signals output by the plurality of taps to reduce near-end crosstalk present in the signal received by the second data line.

Near-end crosstalk cancellation system

An apparatus is described. The apparatus includes a semiconductor chip having cross-talk noise cancellation circuitry disposed between a disturber trace and a trace to be protected from cross-talk noise emanating from the disturber trace. The trace is to be coupled to a receiver disposed on a different semiconductor chip.

Discrete circuit having cross-talk noise cancellation circuitry and method thereof

Embodiments may relate to a connector. The connector may include a plurality of connector pins that are to communicatively couple an element of a printed circuit board (PCB) with an element of an electronic device when the element of the PCB and the element of the electronic device are coupled with the connector. The connector may also include an active circuit that is communicatively coupled with a pin of the plurality of pins. The active circuit may be configured to match an impedance of the element of the PCB with an impedance of the element of the electronic device. Other embodiments may be described or claimed.

Connector with active circuit

Techniques and mechanisms for mitigating signal deterioration in communications between two circuit boards. In an embodiment, a packaged device accommodates coupling to a first circuit board which, in turn, accommodates connection to a second circuit board. In one such embodiment, an amplifier circuit of the packaged device includes an amplifier circuit which comprises a variable resistor and an active circuit element coupled thereto. The device receives via one of the circuit boards a control signal and a voltage which configure the amplifier circuit to provide an impedance matching for communication between the circuit boards. In another embodiment, the device comprises multiple common gate amplifiers which are variously configurable each to provide a respective impedance matching for communications between a motherboard and a dual in-line memory module.

Device, system and method to mitigate signal noise in communications with a memory module

A method is described. The method includes receiving DDR memory channel signals from a motherboard through a larger DIMM motherboard connector. The method includes routing the signals to one of first and second smaller form factor connectors. The method includes sending the DDR memory channel signals to a DIMM that is connected to the one of the first and second smaller form factor connectors.

Memory channel having more than one DIMM per motherboard DIMM connector

Switchable grounded terminal loads are built into, or otherwise coupled to, connectors on motherboards and control devices. The terminal loads are coupled to the bus termination at the connector when the connector is 'stuffed' (connected to a mating connector). The switchable grounded terminal loads replace dummy connectors in preventing empty 'unstuffed' connectors from increasing error risks on active channels.

Connectors with switchable terminal loads

In some examples, a display includes a plurality of display backlight groups, and one or more controller to determine one or more one-dimensional backlight group brightness level adjustments, to determine one or more two-dimensional backlight group brightness level adjustments, and to adjust a brightness of one or more of the backlight groups in response to content of a display image.

Display backlight brightness adjustment

Aspects of the embodiments are directed to a data transmission receiver that includes a neural network circuit for resolving a received bit value. The data transmission receiver can be coupled to a data transmitter by a high speed data link. The neural network circuit can sample a bit value at multiple locations across the bit's unit interval. The neural network circuit can also sample bit values for neighboring bits to the interested bit at multiple sampling locations across unit intervals for the neighboring bits. The neural network circuit can determine the value of the interested bit from the samples of the waveform.

Neural network-based systems for high speed data links

Generally, this disclosure provides systems and devices for reduction of crosstalk between routed signals. A system may include a first pair of signal lines and a second pair of signal lines and each of the pairs of signal lines include a positive signal line and a negative signal line to transmit a differential signal. The system may also include an alternating current coupling capacitor (AC cap) associated with each of the positive signal lines and each of the negative signal lines. The system may further include a routing crossover of the positive signal line and the negative signal line of the second pair of signal lines, to decrease signal crosstalk between the first and second pairs of signal lines. The routing crossover may include at least one of the AC caps.

Signal routing with reduced crosstalk

A method provides modeling of surface roughness effect of an electrical conductor. The method includes identifying first protrusions of a first level using an original flat surface of the conductor as a first base surface and determining a first correction factor of the first level using parameters of the first protrusions. The method further includes identifying second protrusions of a second level using the first protrusions and the first base surface as a second base surface, and determining a second correction factor of the second level using parameters of the second protrusions and regarding the second base surface as being a smooth surface, the smooth surface being a surface of the conductor without surface roughness effect. A final correction factor of the conductor is determined by combining the first correction factor and the second correction factor.

Method for modeling conductor surface roughness

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Portland, OR, United States of America

Yunhui Chu