Hisense USA Corporation

Hisense International Co., Ltd.

Hisense Broadband Multimedia Technologies Co., Ltd.

YungLiang Huang

Hao Wang

Hongwei Mu

Shun Zhang

A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Connection structure for laser and laser assembly

A laser transmitter includes a heat sink, a laser disposed on the heat sink, and a connection apparatus. The connection apparatus includes: a lower substrate and an upper substrate disposed on the lower substrate. An upper surface of the lower substrate is disposed with a first conductor, and a lower surface thereof is disposed with a second conductor. The upper substrate has an upper surface disposed with a third conductor, where the third conductor is connected to the second conductor. The heat sink is disposed on a side of the lower substrate that is close to an end of the first conductor. The laser is connected to an end of the first conductor that is close to the heat sink.

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Shandong, China

YungLiang Huang