Samsung Electronics Co., Ltd.

Yungjun Kim

Kuntack Lee

Jung-Min Oh

Young-Hoo Kim

Hyosan Lee

Jihoon Jeong

Yong-Jhin Cho

Boun Yoon

Yonghee Lee

Yunseok Choi

Byoungho Kwon

Yongkyu Lee

Tae-Hong Kim

Ingi Kim

Taemin Earmme

Sol Han

Seungchul Han

Chae Lyoung Kim

Hyunjoon Park

Eunseok Lee

Seungri Ju

Jaehyun Sung

A wafer cleaning equipment includes a vessel that includes a first inner wall, a second inner wall that faces the first inner wall, and a bottom connected to the first and second inner walls, a plurality of first nozzles disposed on the first inner wall, a plurality of second nozzles disposed on the second inner wall, a support structure disposed between the plurality of first nozzles and the plurality of second nozzles, where the support structure supports a wafer, and a megasonic cleaner disposed between the bottom of the vessel and the wafer supported by the support structure. The megasonic cleaner includes a rack and at least one vibrator disposed below the rack.

Wafer cleaning equipment

A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

Process chamber and substrate processing apparatus including the same

A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.

Rotary body module and chemical mechanical polishing apparatus having the same

Disclosed are a substrate drying apparatus, a facility of manufacturing a semiconductor device, and a method of drying a substrate. The substrate drying apparatus includes a chamber that is configured to dry a substrate at a first temperature, a first reservoir that is configured to store a first supercritical fluid at a second temperature that is less than the first temperature, a second reservoir that is configured to store a second supercritical fluid at a third temperature that is greater than the first temperature, and a supply unit connected between the chamber and the first reservoir and/or second reservoir. The supply unit is configured to supply the chamber with the first supercritical fluid and second supercritical fluid.

Substrate drying apparatus, facility of manufacturing semiconductor device, and method of drying substrate

A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.

Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same

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Seoul, South Korea

Yungjun Kim