Lumens Co., Ltd.

Yungeon Cho

Seunghyun Oh

Seunghoon Lee

Sungsik Jo

Jung-A Lim

Pyounggug Kim

Chunki Min

Kangmin Han

Sangkeun Cho

Jaeyoon Lim

Disclosed is a method for fabricating the light emitting device packages. The method includes: mounting and arranging light emitting device units on a substrate; attaching wavelength converting members to the respective light emitting device units mounted and arranged on the substrate; filling a reflective material between the light emitting device units attached with the wavelength converting members to form a reflective member; and vertically cutting the reflective material such that the reflective material surrounds the individual light emitting device units attached with the wavelength converting members. Also disclosed are light emitting device packages fabricated by the method.

Method for fabricating LED package

Disclosed are a light emitting device package, a backlight unit, and a lighting device which are usable for a display or lighting, and a method of manufacturing the light emitting device package. The light emitting device package includes: a substrate; a light emitting device seated on the substrate; a reflecting member provided on the substrate and provided with a reflector cup surrounding a lateral circumference of the light emitting device; a transparent encapsulant charged in the reflector cup of the reflecting member in a flow state and hardened, and provided with a concave phosphor accommodating space in an upper surface thereof; and a phosphor charged in the phosphor accommodating space in a flow state and hardened.

Light emitting device package, backlight unit, lighting device and its manufacturing method

Provided are a light emitting device package in which lens tilting is prevented to reduce luminance and color deviations and a backlight unit having the same. The light emitting device package includes an encapsulation material disposed on a substrate to surround a light emitting device and a guide member disposed on the encapsulation material to guide an assembly path of a lens. The guide member includes a first inclined surface having a first inclination to guide a light incident part of the lens and a second inclined surface having a second inclination greater than the first inclination to further guide the light incident part of the lens.

Light emitting device package and backlight unit having the same

Growing community of inventors

Osan-si, South Korea

Yungeon Cho