Taiwan Semiconductor Manufacturing Comp. Ltd.

Yung-Yu Wang

Chung-Te Lin

Cheng-Ta Wu

Ting-Chun Wang

Chien-Hua Huang

Yung-Hsiang Chan

Kai-Chieh Liang

Wei-De Ho

Sheng-Yuan Chang

Lan-Hsin Chiang

Chia-Ying Tsai

Structures and formation methods of a semiconductor structure are provided. The semiconductor structure includes an insulating layer covering a device region and an alignment mark region of a semiconductor substrate. A conductive feature is formed in the insulating layer and corresponds to the device region. An alignment mark structure is formed in the first insulating layer and corresponds to the alignment mark region. The alignment mark structure includes a first conductive layer, a second conductive layer covering the first conductive layer, and a first magnetic tunnel junction (MTJ) stack layer covering the second conductive layer. The first conductive layer and the conductive feature are made of the same material.

Alignment mark for MRAM device and method

A fin-type field effect transistor comprising a substrate, at least one gate structure, spacers and strained source and drain regions is described. The at least one gate structure is disposed over the substrate and on the isolation structures. The spacers are disposed on sidewalls of the at least one gate structure. First blocking material layers are disposed on the spacers. The strained source and drain regions are disposed at two opposite sides of the at least one gate structure. Second blocking material layers are disposed on the strained source and drain regions. The first and second blocking material layers comprise oxygen-rich oxide materials.

Fin-type field effect transistor and manufacturing method thereof

Growing community of inventors

Hsinchu, Taiwan

Yung-Yu Wang