Taiwan Semiconductor Manufacturing Comp. Ltd.

Global Unichip Corporation

Yung-Yang Liang

Sheng-Fan Yang

Yuan-Hung Lin

Yu-Cheng Sun

Hung-Chang Kuo

A power delivery device includes a printed circuit board (PCB), a package device, and a chip connecting device. The PCB is configured to receive a first reference voltage and a second reference voltage. The package device is coupled to the PCB, and includes a bump array. The chip connecting device is coupled to the bump array of the package device, and configured to output a first supply voltage and a second supply voltage. The bump array includes first bumps and second bumps. The first bumps are configured to transmit the first reference voltage. The second bumps are configured to transmit the second reference voltage. The first bumps and the second bumps are disposed in parallel.

Power delivery device and method

A signal transmission device includes a transmission line. The transmission line is configured to receive a signal transmitted from a transmission device, and output the signal to a receiving device. The transmission line includes a signal suppression device. The signal suppression device is coupled to the receiving device, and is configured to suppress a reflection signal reflected from the receiving device. The signal suppression device includes a pull-up element and a compensation element. The pull-up element is configured to decrease an equivalent impedance from the signal suppression device to the receiving device. The compensation element is configured to compensate for the equivalent impedance from the signal suppression device to the receiving device. A first terminal of the pull-up element is coupled to a first terminal of the compensation element, and a second terminal of the compensation element is coupled to the receiving device.

Growing community of inventors

Hsinchu, Taiwan

Yung-Yang Liang