Chartered Semiconductor Manufacturing Ltd (corporation)

Yung-Tao Lin

Tze Ho Simon Chan

Sik On Kong

Weining Li

Siow Lee Chwa

Chiew Sin Ping

Ying Jin

Sung Rae Kim

Robert Chin Fu Tsai

Mau Lam Lai

Tin Tin Wee

Tze Ho Semon Chan

Chwa Siow Lee

Chan Tze Ho Simon

Tyrone Philip Stodart

Dai Feng

A new method of fabricating and programming and erasing a Flash EEPROM memory cell is achieved. A tunneling oxide layer is formed overlying a semiconductor substrate. A first polysilicon layer, an interpoly oxide layer and then a second polysilicon layer are deposited. A second polysilicon layer is deposited overlying the interpoly oxide layer. The second polysilicon layer, the interpoly oxide layer, the first polysilicon layer, and the tunneling oxide layer are patterned to form control gates and floating gates for planned Flash EEPROM memory cells. Ions are implanted to form drain junctions where the drain junctions are shallow and abrupt. Ions are implanted to form angled pocket junctions adjacent to the drain junctions. The angled pocket junctions are implanted at a non-perpendicular angle with respect to the semiconductor substrate and are counter-doped to the drain junctions. Ions are implanted to form source junctions that are deeper and less abrupt than the drain junctions.

Low voltage programmable and erasable flash EEPROM

A method of fabricating an LCD-on-silicon pixel device, comprising the following steps. A substrate having an upper layer of silicon is provided. A via is formed in the silicon layer. An opaque conducting layer is deposited over the silicon layer, filling the via. The opaque conducting layer is planarized a reflective layer is deposited over the opaque conducting layer. Alternatively, the via may be formed by a deposition and etch back process with one metal. An opaque conducting layer is then deposited and planarized before deposition of the reflective layer. An LCD-on-silicon pixel device, comprises a substrate having an upper silicon layer. The upper silicon layer has a plug therein comprised of an opaque conducting material. Over the upper silicon layer and the opaque conducting plug is a planar opaque conducting layer and a planar reflective layer is over the planar opaque conducting layer.

Two layer mirror for LCD-on-silicon products and method of fabrication thereof

A new method of fabricating and programming and erasing a Flash EEPROM memory cell is achieved. A tunneling oxide layer is formed overlying a semiconductor substrate. A first polysilicon layer, an interpoly oxide layer and then a second polysilicon layer are deposited. The second polysilicon layer, the interpoly oxide layer, the first polysilicon layer, and the tunneling oxide layer are patterned to form control gates and floating gates for planned Flash EEPROM memory cells. Ions are implanted to form drain junctions where the drain junctions are shallow and abrupt. Ions are implanted to form angled pocket junctions adjacent to the drain junctions. The angled pocket junctions are implanted at a non-perpendicular angle with respect to the semiconductor substrate and are counter-doped to the drain junctions. Ions are implanted to form source junctions that are deeper and less abrupt than the drain junctions.

Means to erase a low voltage programmable and erasable flash EEPROM

A new method of fabricating and programming and erasing a Flash EEPROM memory cell is achieved. A semiconductor substrate is provided. A tunneling oxide layer is formed overlying said semiconductor substrate. A first polysilicon layer is deposited overlying the tunneling oxide layer. An interpoly oxide layer is deposited overlying the first polysilicon layer. A second polysilicon layer is deposited overlying the interpoly oxide layer. The second polysilicon layer, the interpoly oxide layer, the first polysilicon layer, and the tunneling oxide layer are patterned to form control gates and floating gates for planned Flash EEPROM memory cells. Ions are implanted to form drain junctions for planned Flash EEPROM memory cells in the semiconductor substrate where the drain junctions are shallow and abrupt. Ions are implanted to form angled pocket junctions adjacent to the drain junctions. The angled pocket junctions are implanted at a non-perpendicular angle with respect to the semiconductor substrate and are counter-doped to the drain junctions. Ions are implanted to form source junctions where the junctions are deeper and less abrupt than the drain junctions to complete the Flash EEPROM memory cells in the integrated circuit device.

A method of fabricating an LCD-on-silicon pixel device including the following steps. A substrate having an upper layer of silicon is provided. A via is formed in the silicon layer. An opaque conducting layer is deposited over the silicon layer, filling the via. The opaque conducting layer is planarized a reflective layer is deposited over the opaque conducting layer. Alternatively, the via may be formed by a deposition and etch back process with one metal. An opaque conducting layer is then deposited and planarized before deposition of the reflective layer. An LCD-on-silicon pixel device, comprises a substrate having an upper silicon layer. The upper silicon layer has a plug therein comprised of an opaque conducting material. Over the upper silicon layer and the opaque conducting plug is a planar opaque conducting layer and a planar reflective layer is over the planar opaque conducting layer.

A method for integrating salicide and self-aligned contact processes in the fabrication of integrated circuits by using a poly cap mask and a special layout technique is described. A pair of gate electrodes and associated source and drain regions are formed overlying a semiconductor substrate wherein nitride spacers are formed on sidewalls of the gate electrodes. A poly-cap layer is deposited overlying the gate electrodes and source and drain regions. The poly-cap layer is selectively removed overlying one of the source and drain regions between the gate electrode pair where a self-aligned contact is to be formed and removed over one of the gate electrode pair. An insulating layer is deposited over the surface of the semiconductor substrate. The planned self-aligned contact opening is made through the insulating layer to the source/drain region to be contacted wherein the contact opening partially overlies the poly-cap layer over the adjacent gate electrode of the pair. The self-aligned contact opening is filled with a conducting layer to complete fabrication of the integrated circuit device.

Layout method for scalable design of the aggressive RAM cells using a poly-cap mask

A new method of forming non-volatile memory cells with an improved bottom silicon dioxide layer of the O&mdash;N&mdash;O has been achieved. A semiconductor substrate is provided. A tunneling dielectric layer is grown overlying the semiconductor substrate. A polysilicon layer is deposited overlying the tunneling dielectric layer. Nitrogen is implanted into the polysilicon layer to form a nitridized surface region. The polysilicon layer and the tunneling dielectric layer are then patterned to form floating gates. A bottom silicon dioxide layer is grown overlying the floating gates by thermal oxidation of the polysilicon layer. The nitridized surface region reduces the rate of thermal oxidation and creates a smooth surface. A silicon nitride layer is deposited overlying the bottom silicon dioxide layer. A top silicon dioxide layer is formed overlying the silicon nitride layer to complete the O&mdash;N&mdash;O stack. A conductive layer, that may comprise polysilicon, is deposited overlying the top silicon dioxide layer. The conductive layer, the top silicon dioxide layer, the silicon nitride layer, and the bottom silicon dioxide layer are patterned to form control gates and to complete the non-volatile memory cells.

Method to form non-volatile memory cells

A new method of fabricating a Flash EEPROM memory cell is achieved. Ions are optionally implanted into said semiconductor substrate to form threshold enhancement regions of the same type as the semiconductor substrate. A tunneling oxide is formed. A first conductive layer is deposited. An interpoly oxide layer is deposited. A second conductive layer is deposited. The second conductive layer, the interpoly oxide layer, the first conductive layer, and the tunneling oxide layer are patterned to form control gates and floating gates. Ions are implanted to form drain junctions. A mask protects the planned source junctions. The drain junctions are opposite type to the semiconductor substrate. Ions are implanted to form source junctions. A mask protects the drain junctions. The source junctions are opposite type to the semiconductor substrate. Ions are implanted to form channel stop junctions to complete the Flash EEPROM memory cells. The ion implantation is performed at a non-perpendicular angle with respect to the substrate. The channel stop junctions contain the source junctions. The channel stop junctions are opposite type to the semiconductor substrate. A mask protects the drain junctions.

Flash memory cell structure with improved channel punch-through characteristics

A method of fabricating an LCD-on-silicon device, comprising the following steps. A semiconductor structure having a control transistor formed therein is provided. The control transistor having a source and a drain. An interlevel dielectric (ILD) layer over the semiconductor structure is provided. Source/drain (S/D) plugs contacting the source and drain through contact openings in said ILD layer are provided. M1 lines are formed over the ILD layer and connected to at least the S/D plugs. An M1 intermetal dielectric (IMD) layer is deposited and patterned over the M1 lines to form M1 contact openings exposing at least some of the M1 metal lines. M1 metal plugs are formed within the M1 contact openings and M2 metal islands connected to, and integral with, at least the M1 metal plugs. The M2 metal islands having exposed side walls. Sidewall spacers are formed on the exposed M2 metal islands side walls. A second M2 metallization layer is deposited and patterned over the M2 metal islands to form a shielding layer adjacent to and contiguous with the sidewall spacers. The M2 metal islands, sidewall spacers, and shielding layer form a light shielding layer. At least one additional dielectric and conductive layer is formed over the light shielding layer and the M1 intermetal dielectric (IMD) layer. LCD pixels are then formed thereover.

Methods to reduce light leakage in LCD-on-silicon devices

A method for integrating salicide and self-aligned contact processes in the fabrication of logic circuits with embedded memory is described. Isolation areas are formed on a semiconductor substrate surrounding and electrically isolating device areas. Gate electrodes and associated source and drain regions are formed on and in the semiconductor substrate wherein the gate electrodes have silicon nitride sidewall spacers. A metal silicide layer is formed on the top surface of the gate electrodes and on the top surface of the semiconductor substrate overlying the source and drain regions associated with the gate electrodes using a salicide process. A poly-cap layer is deposited overlying the substrate. The poly-cap layer is selectively removed overlying one of the salicided source and drain regions where a self-aligned contact is to be formed, and overlying another of the salicided source and drain regions and a portion of its associated salicided gate electrode where a butted contact is to be formed. An insulating layer is deposited over the surface of the semiconductor substrate. The insulating layer is etched through to form simultaneously the planned self-aligned contact opening and the planned butted contact opening. The self-aligned contact opening and the butted contact opening are filled with a conducting layer to complete fabrication of the integrated circuit device.

Self-aligned contact process using a poly-cap mask

A new method is provided for the creation of an oxide layer that contains three different thicknesses. A first layer of oxide is grown on the surface of a substrate; a first layer of photoresist is deposited and patterned thereby partially exposing the surface of the underlying first layer of oxide. A nitrogen implant is performed into the surface of the underlying substrate; the photoresist mask of the first layer of photoresist is removed. A second layer of photoresist is deposited and patterned, the first layer of oxide is removed from above and surrounding the implanted regions of the substrate. The second mask of resist is removed. The first layer of oxide is reduced in thickness, its thickness is restored to a first thickness by a blanket growth of a second layer of oxide over the exposed surface of the substrate (where no ion implant has been performed) to a third thickness, over the surface of the substrate where the ion implant has been performed to a second thickness and over the surface of the first layer of oxide thereby restoring this layer of oxide to its original first thickness.

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Singapore, Singapore

Yung-Tao Lin