Taiwan Semiconductor Manufacturing Comp. Ltd.

Yung-Shou Cheng

Hsien-Wei Chen

Der-Chyang Yeh

Wei-Cheng Wu

An-Jhih Su

Li-Hsien Huang

Yan-Fu Lin

Chin-Hsien Chen

Methods of testing, manufacturing, and packaging semiconductor devices are disclosed. In some embodiments, a method of testing a semiconductor device includes providing an integrated circuit die having contacts disposed thereon, forming an insulating material over the integrated circuit die and the contacts, and forming an opening in the insulating material over the contacts. A eutectic material is formed in the openings over the contacts, and the integrated circuit die is electrically tested by contacting the eutectic material disposed over the contacts. The eutectic material is removed.

Testing, manufacturing, and packaging methods for semiconductor devices

Growing community of inventors

Dou-Liu, Taiwan

Yung-Shou Cheng