Dell Products Inc.

Advanced Semiconductor Engineering, Inc.

Yung-Sheng Lin

Daniel Lawrence Hamlin

Todd Erick Swierk

Srikanth Kondapi

Chin-Li Kao

Hariprasad Janardana Iyer

An-Hsuan Hsu

Yun-Ching Hung

Vivek Viswanathan Iyer

Geroncio Ong Tan

Hsu-Nan Fang

Yao-Hsien Huang

Chung-Hung Lai

In systems and methods for configuration of a workspace based on short-range wireless location mapping in heterogeneous computing platforms, an Information Handling System (IHS) may include a heterogeneous computing platform that includes a plurality of devices and a memory coupled to the heterogeneous computing platform, where the memory may include a plurality of sets of firmware instructions, where each of the sets of firmware instructions, upon execution by a respective device among the plurality of devices, enables the respective device to provide a corresponding firmware service. Therein, at least one of the plurality of devices operates as an orchestrator configured to collect IHS peripheral location map information from a firmware service running in a wireless peripheral modem device and distribute configuration settings to firmware services running in firmware of one or more devices of the plurality of devices for configuration of the devices and IHS peripherals.

Systems and methods for configuration of a workspace based on short-range wireless location mapping in heterogeneous computing platforms

Systems and methods for managing text settings based upon user distance with heterogeneous computing platforms are described. In an illustrative, non-limiting embodiment, an Information Handling System (IHS) may include a heterogeneous computing platform and a memory coupled to the heterogeneous computing platform, where the memory comprises a plurality of sets of firmware instructions, where each of the sets of firmware instructions, upon execution by a respective device among a plurality of devices of the heterogeneous computing platform, enables the respective device to provide a corresponding firmware service, and where at least one of the plurality of devices operates as an orchestrator configured to: receive an indication of a distance between a user and the IHS based, at least in part, upon context or telemetry data; and modify a text setting in a host Operating System (OS) or application executed by the IHS based, at least in part, upon the indication.

Systems and methods for managing text settings based upon user distance with heterogeneous computing platforms

A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first substrate, a second substrate, and a solid solution layer. The first substrate includes a first metal layer, and the first metal layer includes a first metal. The second substrate includes a second metal layer. The solid solution layer electrically connects the first metal layer to the second metal layer. The solid solution layer includes a first metal-rich layer.

Semiconductor package structure and method for manufacturing the same

An information handling system may include a processor, a memory device, a PMU, and a camera formed into a chassis of the information handling system. The camera includes a lens, a shutter to block the capture of an image by the camera, shutter driver hardware to actuate shutter movement between an open state and a closed state, and a shutter position sensor to detect the position of the shutter. The information handling system includes a microcontroller unit operatively coupled to the camera to receive input describing a set state of the shutter received from user toggle input, compare the set state of the shutter to a detected state of the shutter detected by the shutter position sensor and take remedial action to actuate the shutter driver hardware to change the detected state of the shutter when the detected state of the shutter differs from the set state of the shutter.

Method and apparatus for closed-loop camera shutter control and remediation hardware

A semiconductor package includes a first substrate, a first flow channel and a second flow channel. The first flow channel is on the first substrate. The second flow channel is on the first substrate and in fluid communication with the first flow channel. The second flow channel is spaced from an inlet and an outlet of the first flow channel. The first flow channel and the second flow channel constitute a bonding region of the first substrate.

Semiconductor packages

A system for configuring an information handling system based on a multi-user state change. An intelligent sensor hub communicates with sensors to detect the number of persons in a field of view of the information handling system. When the intelligent sensor hub determines there is a change in the number of persons, the information is sent out-of-band to an embedded controller (EC) independent of a host operating system. The EC makes a change to the configuration of the information handling system if needed.

System and method for multi-user state change

Present disclosure provides a semiconductor package, including a first substrate having a first active surface and a first trench recessed from the first active surface, a second substrate having a second trench facing the first trench, and a pathway cavity defined by the first trench and the second trench. The first trench comprises a first metal protrusion and a first insulating protrusion. A method for manufacturing the semiconductor package described herein is also disclosed.

Semiconductor package and method for manufacturing the same

A semiconductor package structure includes a semiconductor die surface having a narrower pitch region and a wider pitch region adjacent to the narrower pitch region, a plurality of first type conductive pillars in the narrower pitch region, each of the first type conductive pillars having a copper-copper interface, and a plurality of second type conductive pillars in the wider pitch region, each of the second type conductive pillars having a copper-solder interface. A method for manufacturing the semiconductor package structure described herein is also disclosed.

Growing community of inventors

Kaohsiung, Taiwan

Yung-Sheng Lin