Mosel Vitelic Corporation

Promos Technologies, Inc

Siemans Ag

Yung-nien Teng

A method for improving the planarization of a BPSG layer over a semiconductor substrate, where the substrate contains underlying structures, is disclosed. The method comprises the steps of: forming a first borophosphosilicate glass (BPSG) layer over and between the underlying structures; reflowing the first BPSG layer using a thermal process; performing a chemical mechanical polishing (CMP) step on the first BPSG layer; forming a second BPSG layer over the first BPSG layer; and reflowing the second BPSG layer using a thermal process.

Growing community of inventors

Hsin-chu, Taiwan

Yung-nien Teng