Taiwan Semiconductor Manufacturing Comp. Ltd.

Yung-Long Chen

Chih-Chiang Tseng

Chi-Tung Lai

Ching-Jung Hsu

I-Chen Chiang

Shao-Yen Ku

Ming-Chieh Hsu

Yu-Chun Chen

Fang-Pin Chiang

Feng-An Yang

Bo-Zhang Chen

Chun-Feng Hsu

Hwai-Te Chiu

Yi-Tsang Chen

Yi-Wen Huang

Liang-Chieh Huang

Rong-Shyan Pan

Heng-Yi Tzeng

Yi-Chen Wang

Heng-Yi Tseng

Chieh-Jan Huang

Yung-Ching Chen

Yi-Chao Chang

Chin-Hsing Su

Chi-Chan Yin

Pang-Ping Lo

Chong-Cheng Su

Chi-Wei Chiu

A slurry blending tool may include a blending tank to receive and blend one or more materials into a slurry, and at least one inlet pipe connected to the blending tank and to provide the one or more materials to the blending tank. The at least one inlet pipe may vertically enter the blending tank and may not contact the blending tank. The slurry blending tool may include a blending pump partially provided within the blending tank and to blend the one or more materials into the slurry. The slurry blending tool may include an outlet pipe connected to the blending pump and to remove the slurry from the blending tank.

High-throughput, precise semiconductor slurry blending tool

A chemical dispensing system is capable of simultaneously supplying a semiconductor processing chemical for production and testing through the use of independent chemical supply lines, which reduces production downtime of an associated semiconductor process, increases throughput and capability of the semiconductor process, and/or the like. Moreover, the capability to simultaneously supply the semiconductor processing chemical for production and testing allows for an increased quantity of semiconductor processing chemical batches to be tested with minimal impact to production, which increases quality control over the semiconductor processing chemical. In addition, the independent chemical supply lines may be used to supply the semiconductor processing chemical to production while independently filtering semiconductor processing chemical directly from a storage drum through a filtration loop.

Chemical dispensing system

A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.

Slurry dispersion system with real time control

An apparatus includes a production tool and a pipe connected to the production tool. The pipe includes an inner pipe formed of a metal-free material, an outer pipe encircling the inner pipe, and an inlet connected to a channel between the inner pipe and the outer pipe. The apparatus further includes a chemical supply system connected to the pipe. The chemical supply system is configured to supply a chemical through a channel encircled by the inner pipe to the production tool.

Chemical dispense system with reduced contamination

A gas-supply system includes a gas container filled with gas, a gas flow controller coupled to the gas container via a first tube, and an operation device electrically connected to the gas flow controller. The gas-supply system further includes a pressure transducer installed on a second tube connected to the gas flow controller and configured to generate a pressure signal to the operation device according to the pressure of the gas in the second tube. The operation device is configured to generate a control signal to the gas flow controller according the pressure signal, and the gas flow controller is configured to adjust the flow rate of the gas in the second tube according to the control signal.

Gas-supply system and method

A gas-supply system includes a gas container filled with gas, a gas flow controller coupled to the gas container, and an operation device electrically connected to the gas flow controller. The gas-supply system further includes a buffer tank coupled to the gas flow controller and configured to receive the gas from the gas container via the gas flow controller. Furthermore, a pressure transducer disposed on the buffer tank and configured to generate a pressure signal to the operation device according to the pressure of the gas in the buffer tank. The operation device is configured to generate a control signal to the gas flow controller according the pressure signal, and the gas flow controller is configured to adjust the flow rate of the gas according to the control signal to keep the pressure of the gas in the buffer tank in a predetermined pressure range.

Systems and methods are provided for preparing a plurality of slurry particles. The system includes: a tank configured to contain and provide the slurry particles, a sampling module configured to sample at least one slurry particle within the tank and obtain at least one parameter related to a particle size, and a controller coupled to the tank and the sampling module, configured to vibrate the slurry particles within the tank based on the at least one parameter.

Systems and methods for monitoring and controlling particle sizes in slurries

A slurry feed system suitable for chemical mechanical planarization (CMP) processes in a semiconductor fabrication facility and related method. The slurry feed system includes a valve manifold box having a discharge piping header fluidly connected to at least one CMP station and a first slurry supply train. The first slurry supply train may include a slurry mixing tank, day tank, and at least two slurry feed pumps arranged in series pumping relationship. The first slurry supply train defines a first slurry piping loop. In one embodiment, a second slurry supply train defining a second slurry piping loop is provided. The valve manifold box is operable to supply slurry from either or both of the first and second slurry piping loops to the CMP station.

Slurry system for semiconductor fabrication

Growing community of inventors

Taipei, Taiwan

Yung-Long Chen