Advanced Semiconductor Engineering, Inc.

Richtek Technology Corporation

Chipbond Technology Corporation

Yung-Jen Chen

Min-Lung Huang

Yi-Chuan Ding

Yeh-Shun Chen

Yu-Chieh Lin

Chia-Chi Liu

Fu-To Lin

Wei-Te Chu

Tun-Yu Chen

Lin-Hsin Chen

Hua-Ping Chen

Charles Yang

Heng-Ting Liu

A buck converter includes a quick response circuit, a compensator coupled to an output node, an interleaving logic circuit coupled to the compensator, a plurality of on-time generators, a plurality of OR gates coupled to the corresponding on-time generator, a plurality of power stages coupled to the corresponding OR gates, a plurality of inductors and an output capacitor. Each on-time generator is coupled to the interleaving logic circuit, an input node and the output node. The quick response circuit includes a voltage droop sensor coupled to the output node, a load frequency sensor coupled to the output node, a quick response signal generator coupled to the voltage droop sensor, a maximum quick response signal generator coupled to the voltage droop sensor and the load frequency sensor, an AND gate coupled to the quick response signal generator, the maximum quick response signal generator and the plurality of OR gates.

Buck converter with quick response mechanism and method thereof

A switching regulator which has load transient quick response ability includes at least one power stage circuit and a control circuit. The control circuit includes a pulse width modulation (PWM) signal generation circuit and a quick response (QR) signal generation circuit. The PWM signal generation circuit generates a PWM signal according to an output voltage and a QR signal, to control a power switch of the corresponding power stage circuit, thus converting an input voltage to the output voltage. The QR signal generation circuit includes a differentiator circuit and a comparison circuit. The differentiator circuit performs a differential operation on a voltage sensing signal related to the output voltage, to generate a differential signal. The comparison circuit compares the differential signal with a QR threshold signal, such that when the differential signal exceeds the QR signal, the PWM signal generation circuit performs a QR procedure.

Switching regulator and control circuit thereof and quick response method

In accordance with the present invention, there is provided a semiconductor device comprising a semiconductor die or chip, a package body and a through package body via. The semiconductor chip includes a plurality of conductive pads. The package body encapsulates a sidewall of the semiconductor chip, and has at least one hole formed therein having a sidewall which is of a prescribed first surface roughness value. The through package body via is disposed in the hole of the package body and comprises a dielectric material and at least one conductive interconnection metal. The dielectric material is disposed on the sidewall of the hole and defines at least one bore having a sidewall which is of a second surface roughness value less than the first surface roughness value. The interconnection metal is disposed within the bore.

Semiconductor device having conductive via and manufacturing process for same

Semiconductor device having conductive via and manufacturing process

A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer.

Package, packaging method and substrate thereof for sliding type thin fingerprint sensor

A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion.

Sliding type thin fingerprint sensor package

Growing community of inventors

Kaohsiung, Taiwan

Yung-Jen Chen