Taiwan Semiconductor Manufacturing Comp. Ltd.

Yung-Dar Chen

Po-Sung Kuo

Shih-Chang Shih

Yen-Chun Wang

Jung-Hao Hsiue

Yung-Hsiang Chen

Ming-Tsong Wang

Tung-Li Wu

Fu-Shun Lo

Ming-Chien Wen

Shiuh-Sheng Chang

Jheng-Long Chou

Wen-Chong Chiang

Ming-Wen Huang

Shiuh-Shzng Chang

Jung-Hau Hsiue

Rong Hau Hsueh

Simon King

Dar-Rung Kuo

Wen-Hsiung Wu

An exhaust system and a mini-exhaust static pressure controlling apparatus thereof for controlling a process area. The mini-exhaust static pressure controlling apparatus has an exhaust chamber and an auto release damping device. The exhaust chamber has an air inlet connected to the process area receiving air exhaust from the process area, and an air outlet venting the air exhaust. The auto release damping device has a diaphragm pre-stressed in an arc shape with a coefficient of elasticity and an adjusting device for applying a stress on the diaphragm to maintain the arc shape of the diaphragm, and is disposed on the exhaust chamber to control static pressure of the air exhaust in the exhaust chamber.

Exhaust system and mini-exhaust static pressure controlling apparatus thereof

An air supply system for a clean room with a critical machine. An intake duct connects the exterior of the clean room to a make-up air unit, and is configured to transport external air into the make-up air unit. A first air duct connects the make-up air unit to an air conditioning cabinet including a first chemical filter, and is configured to transport the air flowing through the make-up air unit into the air conditioning cabinet. The first chemical filter removes airborne molecular contamination from the air transported into the air conditioning cabinet. A second air duct connects the air conditioning cabinet to the critical machine, and is configured to transport the air flowing through the first chemical filter of the air conditioning cabinet into the critical machine. An exhaust duct connects the critical machine to the exterior of the clean room, discharging waste gas produced in the critical machine.

Air supply systems and pressure adjustment devices for use therewith

An air purification system for treating pollutants in a gas stream. The air purification system includes a housing with a plurality of nozzles, an acidic water supply device and an alkaline water supply device. The housing introduces the gas stream. The acidic water supply device supplies acidic water for first nozzles to spray acidic mist. The alkaline water supply device supplies alkaline water for second nozzles to spray alkaline mist. The acidic mist and alkaline mist neutralize acidic gas and alkaline gas contained in the gas stream.

Dual-type air purification system

An air purification system which is well-suited to removing particles from outside air as the air flows into a cleanroom used in the fabrication of semiconductor integrated circuits. A housing provides at least one spray nozzle for spraying fine mist water droplets. In use, the water droplets capture the airborne particles in the air flowing through the housing and adhere to the water droplet target. The water droplets coalesce and form larger droplets which adhere to the surface of the water droplet target and ultimately collect in a drain pan. The low-density water droplet target prevents large pressure differentials from forming in the housing, which pressure differentials may otherwise cause re-vaporization of the water droplets from the target and re-flow of the particles in the flowing air.

Trap-type air purification system

An anti-electrostatic discharge spray gun apparatus and method for preventing crystallization of particles formed as a result of electrostatic discharge from forming on a spray gun nozzle and an associated pair of oppositely charged electrodes disposed on the gun. The apparatus has a housing; a nozzle attached to the housing for dispensing gas; a device for dispensing a gas through the nozzle; a device for electrostatically discharging a gas dispensed through the nozzle; and a device for restricting the flow of a gas through the nozzle. The device for dispensing and restricting flow of a gas through the nozzle may be either a bypass piping having a flow control means or a stopper that operates to provide a constant but low volume flow of an inert gas such as nitrogen to the nozzle to prevent particle build up or crystallization from occurring.

Anti-electrostatic discharge spray gun apparatus and method

An apparatus and a method for trapping a toxic gas contained in an exhaust gas from a process chamber are disclosed. In the apparatus, two toxic gas traps are provided which are connected in series with a toxic gas sensor provided thereinbetween and in fluid communication with the two traps. When toxic gas is detected by the toxic gas sensor, i.e., an indication that the first toxic gas trap is fully consumed, the second toxic gas trap is used to replace the first toxic gas trap, while a new toxic gas trap is installed as the second toxic gas trap. The present invention novel apparatus and method enables the full use or utilization of a toxic gas trap and results in significant cost savings. Furthermore, the present invention novel apparatus and method improves the yield of a fabrication process by reducing the machine down time since the service frequency for the chamber is reduced.

Apparatus and method for trapping a toxic gas

A method and apparatus for measuring a gap between two opposing surfaces by utilizing a dial gauge instead of feeler gauges is disclosed. The apparatus includes a mounting block, an extension arm and a dial gauge which may be used to measure any gap distance between about 0.01 mm and about 10 mm. The method is carried out by first zeroing the dial gauge by utilizing a calibration block which has the same thickness as the gap distance to be measured. The novel method and apparatus can be used to replace a conventional feeler gauge method and achieve the benefits of greatly improved precision in measurement, a short measurement time required and completely eliminating human error due to operator dependency.

Method and apparatus for measuring a gap

A method for developing a photoresist pattern on a semiconductor wafer using the puddle method is described, wherein the wafer is subjected to several periods of slow rotation while the puddle is in place on the wafer, The process also embraces an improved wafer-to-wafer uniformity of development. A step by step example of the process is given wherein a TMAH developer is used. Two developer puddle applications are used and each puddle undergoes three 2 second rotation periods at 20 rpm., each followed by a 4 second idle period. The intermittent puddle rotations improve the uniformity of development over the wafer thereby improving the uniformity and accuracy of critical dimensions in the resultant pattern. Although the process induced defect densities remain about the same, the sizes of the defects is reduced. In addition, the improved process reduces the overall development cycle time by about 34 percent.

Photoresist development method with reduced cycle time and improved

An apparatus and a method for measuring eccentricity between two circular members which are attached together is provided. The apparatus includes a vernier measuring device of a main scale and a vernier scale, and a mounting block having a V-shaped notch in a top surface for receiving a circular member and for mounting the main scale of the vernier measuring device securely to the block. The novel apparatus and method can be used to not only making direct measurement of the eccentricity between the two centers, they may also be used to read directly the number of pulses required for making adjustment to a robot arm when the divisions on the main scale and the vernier scale are specifically designed for such purpose. The method can be carried out by first aligning the zero setting on the main scale with the center of the first circular member, and then aligning the zero setting on the vernier scale with the center of the second circular member, and then reading the distance between the two zero settings for determining the eccentricity.

Apparatus and method for measuring eccentricity between two circular

The invention provides four sub-patterns located at the periphery of the wafer surface at 90-degree intervals. Each of the four sub-patterns is divided into four alignment scales where each alignment scale is yet again subdivided into a multiplicity of alignment marks. This multiplicity of sub-patterns and alignment scales with each scale having a multiplicity of alignment marks results in very accurate and convenient alignment capability.

Method of calibrating WEE exposure tool

Defects, associated with the presence of microbubbles in the photoresist developer solution, have been largely eliminated by providing an apparatus and method whereby the photoresist developer solution, while on standby status in a buffer tank, is maintained at a negative pressure (about minus 0.5 kg/cm.sup.2). This allows any microbubbles, that were introduced into the solution during the course of conveying it to the buffer, to escape. The negative pressure in the buffer during its refill and standby stages is generated by adding a venturi valve to the existing equipment. This keeps the impact on the control software to a minimum and has little or no effect on the cost of the process.

Eliminating microbubbles in developer solutions to reduce photoresist

A method of direct transfer printing of a photoresist pattern layer onto the first pattern layer of a phase shift photomask reticle is described which allows completion of the photomask pattern at a much lower cost than the conventional multiple-pass photolithographic process. The direct transfer of the resist pattern from printing plate to mask surface by means of a platen is especially suitable for non-critical regions such as border regions, seal bands, identification marks, and the like.

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Hsinchu, Taiwan

Yung-Dar Chen