Hon Hai Precision Industry Co., Ltd.

Foxconn Precision Components Co., Ltd.

Yung-Chou Chen

Wen-Chang Chen

Ying-Lin Chen

Richard M Lee

Fu-Yen Tseng

Stanley Chen

Su-Jen Cheng

Jeff Luo

Allen Tan

Chi-Jen Chen

Kai-Shing Hou

Masataka Mochzuki

Chi-Tsung Peng

An exemplary method of making an FPC includes forming a substrate comprising metal foil layers interleaved with intervening layers by: (a) laminating intervening layers with metal foil layers; (b) adhering a covering film to outermost surfaces of the substrate; (c) defining a hole in one side of the substrate through the covering film and at least two metal foil layers and the intervening layer between the at least two metal foil layers by etching or laser technology; and (d) plating a portion of an inner wall of the hole with conductive material to form a via to electrically connect the at least two metal foil layers.

Method of making a flexible printed circuit board

A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module.

Camera module

A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.

Camera module with circuit board

A heat dissipating device includes a heat sink ( ) for removing heat from an electronic device ( ), and a plurality of adjusters ( ) for adjusting distance and contact force between the electronic device and the heat sink. The heat sink defines a plurality of receiving holes ( ) for receiving respective adjusters, and a plurality of communicating through holes ( ) whose diameters are smaller than those of the receiving holes. A shoulder ( ) of the heat sink is formed where each receiving hole communicates with each through hole. Each adjuster comprises a connecting shaft ( ), a lock screw ( ) with a head ( ), and a spring ( ). The lock screw threadedly engages with the connecting shaft, and the spring is secured between the shoulder of the heat sink and the head.

Heat dissipating device for electronic device

A fan duct induces an air flow generated by a fan of a lower supply of a computer to flow simultaneously through at least two heat-generating components of the computer. The fan dut is formed by plastic injection molding to have a cuboidal configuration, defining a first opening in alignment with the fan, a second opening proximate a first heat-generating component, and a third opening proximate a second heat-generating component when the fan duct is mounted in the computer at a predetermined position. When the fan is operated in a direction to draw air from the computer, an air flow is generated to simultaneously flow through the two heat-generating components and into the fan duct via the second and third openings. The heated air is then expelled out of the fan duct via the first opening to reach an exterior of the computer.

Heat dissipation enhancing device

Growing community of inventors

Taipei Hsien, Taiwan

Yung-Chou Chen