Industrial Technology Research Institute

Siliconware Precision Industries Co., Ltd.

Yung-Chih Lin

Fu-Di Tang

Ching-Chiuan Wei

Chien-Hung Chen

Ta-Jen Peng

Chen-Yu Kai

Ke-Hen Chen

Jia-Cheng Sun

Sheng-Ming Ma

Tian-You Hou

Chen-Hui Kuo

Shin-Tzong Su

This disclosure provides a machine tool adjustment method and system thereof. The machine tool adjustment method includes the following steps: enabling a machine tool to perform a circular test; obtaining a measured error value Efrom a measuring instrument, and the measured error value Eis defined by the difference between the actual circular trajectory and the preset circular trajectory during the circular test; determining an error condition of the tool machine from the measured error value E; determining whether the error condition is less than a predetermined criteria; if not, defining a compensation parameter according to the error condition and enabling the machine tool to perform another circular test according to the set compensation parameter until the error condition is less than the predetermined criteria; and if yes, ending the circular test and the machine tool adjustment is finished.

Machine tool adjustment method and system thereof

A thermal compensation control system for a machine tool having a milling cutter and a cutter driver includes a tool setting probe, a temperature sensor, a workpiece touch probe, and a controller. The cutter driver is connected to the milling cutter to drive the milling cutter to process the work piece based on a control signal. The tool setting probe is configured to detect a cutter length of the milling cutter. The temperature sensor is configured to sense a measured temperature of the cutter driver or the milling cutter. The workpiece touch probe is configured to measure processing errors of the processed work piece. The controller is configured to generate the control signal based on a processing instruction, a temperature compensation model, the cutter length, and the measured temperature. The controller is further configured to determine whether to modify the temperature compensation model based on the processing errors.

Thermal compensation method and thermal compensation control system for machine tools

A Quad Flat No-Lead (QFN) semiconductor package includes a die pad; I/O connections disposed at the periphery of the die pad; a chip mounted on the die pad; bonding wires; an encapsulant for encapsulating the die pad, the I/O connections, the chip and the bonding wires while exposing the bottom surfaces of the die pad and the I/O connections; a surface layer formed on the bottoms surfaces of the die pad and the I/O connections; a dielectric layer formed on the bottom surfaces of the encapsulant and the surface layer and having openings for exposing the surface layer. The surface layer has good bonding with the dielectric layer that helps to prevent solder material in a reflow process from permeating into the die pad and prevent solder extrusion on the interface of the I/O connections and the dielectric layer, thereby increasing product yield.

Method for fabricating quad flat non-leaded semiconductor package

Quad flat non-leaded semiconductor package

Growing community of inventors

Taichung, Taiwan

Yung-Chih Lin