Samsung Electronics Co., Ltd.

Yung-cheol Kong

Byoung-rim Seo

Han-Sung Ryu

Yong-Hoe Cho

Woon-bae Kim

Tae-Je Cho

Jang-woo Lee

Mitsuo Umemoto

Dong-min Kim

Jong-bo Shim

Pyoung-Wan Kim

Kyung-suk Oh

Kyong-soon Cho

Ji-woong Park

Woo-hyun Park

Beoung-ouk Min

Jae-myeong Cha

A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.

Semiconductor package and method of manufacturing the same

Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.

Package for processing sensed-data, sensed-data processor, and system for processing sensed-data

A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Camera module and method of manufacturing the camera module

An image sensor module includes a circuit board, an image sensor package and an optical system. The circuit board has an upper surface and a lower surface, the substrate having a window. The image sensor package includes a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window. The optical system is provided on the upper surface of the circuit board to guide light from an object to the image sensor chip.

Image sensor module having image sensor package

An image sensor module may include an image sensor, a variable thickness member and a lens member. The image sensor may include a light receiver configured to receive a light. Further, a driving voltage may be applied to the image sensor. The variable thickness member may be arranged on the image sensor adjacent to the light receiver. Further, the variable thickness member may have a variable thickness along an optical axis of the light in accordance with the driving voltage through the image sensor.

Image sensor module, method of manufacturing the same, camera module including the same and electronic device including the camera module

Image sensor module, camera module including the same and electronic device including the camera module

Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module. Example embodiment camera modules may include a semiconductor package including an image sensor chip. A transparent substrate may include an upper plate portion and/or a supporting portion defined by a cavity under the upper plate portion, and the supporting portion may be attached on the semiconductor package. The upper plate portion may be spaced from the semiconductor package by the supporting portion. A lens member may be attached to the upper plate portion of the transparent substrate. A stop member may be formed on a top side of the transparent substrate and may expose a portion of the lens member.

Methods of fabricating camera modules including aligning lenses on transparent substrates with image sensor chips

Camera module and method of fabricating the same

Growing community of inventors

Cheonan-si, South Korea

Yung-cheol Kong