Han's Laser Technology Industry Group Co., Ltd.

Han's Cnc Science and Technology Co., Ltd

Han's Cnc Technology Co., Ltd.

Shenzhen Han's Laser Technology Co. Ltd.

Shenzhen Han's Smart Controltechnology Co., Ltd.

Shenzhen Han's Scanner S&t Co., Ltd.

Yunfeng Gao

Jiaying Li

Chaoming Zhou

Bo Sun

Yuqing Chen

Jiangang Yin

Wei Zhu

Yan Chen

Lei Xiao

Jin Wang

Yanhua Wang

Changhui Zhuang

Fuhai Li

Jiangang Lu

Bing Ding

Guodong Ma

Chengwan Gong

Jiantao Zhao

Jinbin Yang

Yanhua Ning

Yuxin Feng

Xiaojun Zhang

Xiao Liu

Hai Huang

Hong Chen

Gang Xiao

Wei Zeng

Guoping Zhang

Feng Cao

Jiangang Tang

Yuting Li

Hao Yang

Xuerui Yuan

Yangting Qi

Zekai Xie

Lingtian Diao

Zhixian Chen

Yuguo Peng

Baohua Zhu

Jiaming You

Zhiqiang Fang

Yezhao Lu

Hi Huang

Jiayang Li

Guangneng Wang

Kesheng Chen

Hongyan Qin

Gang Pu

Chengquan Zhou

Jianfei Chen

Yanqing Yang

Zhongqian Li

Huanyin Xin

Hongjiang Zhang

Encai Ji

Jian Yuan

Song Lu

Zhengfeng Liu

Qitao Lv

Xilu Li

Provided are a laser cutting device and a laser cutting method. The laser cutting device comprises a beam expanding element provided with a plurality of lens sets, wherein optical axes of the plurality of lens sets are located in the same line and each lens set comprises at least one lens; the beam expanding element is configured to convert an incident beam into a first beam; and a spectroscopic element arranged on a light path of an emitted light of the beam expanding element, and wherein the spectroscopic element is configured to convert the first beam into multiple second beams that are annular and spaced apart from each other.

Laser cutting device and laser cutting method

The present application relates to a bus communication signal conversion method and device, a medium, and a numerical control machine tool control equipment. The bus communication signal conversion method comprises: acquiring an interface type of a bus interface of a first equipment end; receiving an output signal sent by a communication interface of a second equipment end; extracting a working parameter value of the second equipment end from the output signal; and sending the working parameter value of the second equipment end to the bus interface of the first equipment end according to a communication protocol corresponding to the interface type. The use of the present method can achieve signal conversion between different types of interfaces, thereby ensuring effectiveness of communication.

Bus communication signal conversion method and device, medium, and numerical control machine tool control equipment

The present application relates to a data processing method for a numerical control system, a computer device and a storage medium. The method comprises: receiving a data request, the data request carrying a target data identifier; parsing the data request to obtain an interactive type corresponding to the target data identifier; when the interactive type corresponding to the target data identifier is a type corresponding to real-time data, searching for data corresponding to the target data identifier in a shared memory of the numerical control system; transferring the data corresponding to the target data identifier from the shared memory to a data cache of the numerical control system and outputting the data.

Control system driven by real time and non-real time data

A non-contact transporting apparatus () includes: a negative pressure assembly () configured to generate a negative pressure airflow within the non-contact transporting apparatus; and an ultrasonic assembly () connected to the negative pressure assembly (). The ultrasonic assembly () includes: an ultrasonic transducer () configured to convert a high-frequency ultrasonic electrical signal into a high-frequency mechanical vibration, one end of the ultrasonic transducer () is connected to the negative pressure assembly (); an ultrasonic horn () configured to amplify the high-frequency mechanical vibration, one end of the ultrasonic horn () is connected to one end of the ultrasonic transducer () away from the negative pressure assembly (); and an ultrasonic chuck () configured to amplify and convert the high-frequency mechanical vibration, the ultrasonic chuck () is connected to one end of the ultrasonic horn () away from the ultrasonic transducer ().

Non-contact transporting apparatus

An all solid-state laser light source device comprises a diode-pump laser and the following devices sequentially arranged in an optical path direction of laser light: a coupling optical fiber, a coupling lens assembly, and a resonant cavity. An anisotropic laser crystal is provided in the resonant cavity. Absorption spectra of the anisotropic laser crystal comprise a &#x3c0; polarization absorption spectrum and a &#x3c3; polarization absorption spectrum. Each of the &#x3c0; polarization absorption spectrum and the &#x3c3; polarization absorption spectrum has a peak pump region and a left pump region and a right pump region arranged on either side of the peak pump region. Pump light outputted by diode-pump laser has a wavelength &#x3bb; falling within the left pump region or the right pump region.

All solid-state laser light source device

A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first COlaser beam the coating via a COfocusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second COlaser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second COlaser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.

Method and device for cutting sapphire

A laser scanning device (), comprising: a system on chip structure () configured to receive and process a graphic data transmitted by an external computer () to generate a galvanometer movement instruction and a laser control instruction; and galvanometer () configured to receive the galvanometer movement instruction and move according to the galvanometer movement instruction; wherein the laser control instruction is transmitted to an external laser (), so that the laser () and the galvanometer () move synchronously. The above laser scanning device () and scanning system can integrate a laser control function and a galvanometer control function into the same chip by a system on chip design, which does not only reduce cost of the system, but also improve reliability of the system. Because all information are transmitted in the same one chip, there is no signal transmission cable employed between a conventional movement control card and a galvanometer driver, which results in a better real time, and avoids various problems due to transmission from the conventional control card to the galvanometer.

Laser scanning device and laser scanning system

An enhanced digital light processing-based mask projection stereolithography method and apparatus are disclosed, where the apparatus comprises: a control platform capable of slicing a model of a to-be-prototyped object into layers, converting the layer into a bitmap, and further dividing the layer into a main body area and boundary filling areas; a digital light processing unit that is controlled by the control platform and capable of emitting a first light beam used for the corresponding main body area of the layer of the to-be-prototyped object; and a laser marking unit that is controlled by the control platform and capable of emitting a second light beam used for the corresponding boundary filling areas of the layer of the to-be-prototyped object. The present invention can not only implement high-speed prototyping but also avoid an edge distortion, thereby improving precision of object prototyping.

Enhanced digital light processing-based mask projection stereolithography method and apparatus

A frequency-doubled laser, including: a first reflecting mirror, a second reflecting mirror, a gain medium, a telescope module, a polarizing element, and a nonlinear crystal; the first reflecting mirror and the second reflecting mirror are spaced apart to form a resonator of the frequency-doubled laser; the polarizing element, the gain medium, the telescope module, and the nonlinear crystal are located in the resonator, and the telescope module is located between the gain medium and the nonlinear crystal. The present disclosure further provides a method of generating harmonic laser. The frequency-doubled laser and the method of generating harmonic laser make the position of nonlinear crystal more flexible, and the possibility of damage to the nonlinear crystal is reduced.

Frequency-doubled laser and method of generating harmonic laser

A laser processing method for a sapphire includes: acquiring an image of the sapphire during processing; performing an edge detection to the image to acquire a coordinate of a crack; determining an offset parameter according to the coordinate of the crack; adjusting a laser processing position according to the offset parameter; and further processing the sapphire in accordance with the adjusted laser processing position.

Laser processing method, apparatus for sapphire and storage medium

The present invention relates to a laser lift-off method of wafer. The method includes the steps as follows: focusing laser in an inside for a wafer () to form a plurality of cracking points (), the plurality of cracking points () are located on a separating surface (); and exerting, under a temperature of &#x2212;400K to 0K, forces with opposite directions to opposite sides of the wafer (), thereby dividing the wafer () into two pieces along the separating surface ().

Laser lift-off method of wafer

A reconnaissance objective lens used for an unmanned aircraft, the reconnaissance objective lens comprising a first lens (L), a second lens (L), a third lens (L), a fourth lens (L) and a fifth lens (L) successively and coaxially arranged along the transmission direction of incident light rays. The first lens (L) is a biconvex lens, the second lens (L) is a biconcave lens, the third lens (L) is a meniscus lens, the fourth lens (L) is a meniscus lens, and the fifth lens (L) is a meniscus lens. The first lens (L) and the second lens (L) are glued to one another, and the fourth lens (L) and the fifth lens (L) are glued to one another. By using the rational configuration of the first to fifth lenses (L-L) having positive and negative optical power, the reconnaissance objective lens used for an unmanned aircraft effectively solves the technical problem of it being difficult for current reconnaissance objective lenses for unmanned aircraft to achieve a large field of view, high resolution and low distortion.

Reconnaissance objective lens used for unmanned aircraft

A far infrared detector and objective lens and lens set thereof. The far infrared imaging lens set () comprises a first lens () and a second lens () arranged in sequence along a principal axis; the first lens () has a first curved surface () having a radius of curvature of 2.4&#xd7;(1&#xb1;5%) mm and a second curved surface () having a radius of curvature of 2&#xd7;(1&#xb1;5%) mm; the second lens () has a third curved surface () having a radius of curvature of 50&#xd7;(1&#xb1;5%) mm and a fourth curved surface () having a radius of curvature of 60&#xd7;(1&#xb1;5%) mm; wherein the first curved surface (), the second curved surface (), the third curved surface (), and the fourth curved surface () are arranged in sequence; the first curved surface (), the second curved surface () and the third curved surface () are all convex to the object side, and the fourth curved surface is convex to the image side. Distant targets can be detected in dark and foggy environments, and imaging capability is high.

Far infrared imaging lens set, objective lens and detector

An optical lens for laser marking includes a first lens (L), a second lens (L), and a third lens (L), which are successively coaxially arranged along a transmission direction of incident light, wherein the first lens (L) and the second lens (L) are meniscus lenses, and the third lens (L) is a biconvex lens; wherein the first lens (L) has a first surface (S) and a second surface (S), the second lens (L) has a third surface (S) and a fourth surface (S), the third lens (L) has a fifth surface (S) and a sixth surface (S); the first surface (S) to the sixth surface (S) are successively arranged along the transmission direction of the incident light; wherein radii of curvature of the first surface to the sixth surface are &#x2212;47&#xb1;5% mm, &#x221e;, &#x2212;218&#xb1;5% mm, &#x2212;81&#xb1;5% mm, 778&#xb1;5% mm, and &#x2212;142&#xb1;5% mm, respectively; wherein central thicknesses of the first lens, the second lens, and the third lens are 4&#xb1;5% mm, 15&#xb1;5% mm, and 18&#xb1;5% mm, respectively. The optical lens for laser marking not only has high engraving quality, but also has a high engraving speed with a higher efficiency than conventional engraving lens.

Optical lenses for laser marking

A lens module () and a 3D printer () comprising same. The lens module comprises a first lens (L), a second lens (L) and a third lens (L) sequentially and coaxially arranged in the transmission direction of incident light. The first lens, the second lens and the third lens are all meniscus lenses. The first lens comprises a first curved surface (S) and a second curved surface (S). The second lens comprises a third curved surface (S) and a fourth curved surface (S). The third lens comprises a fifth curved surface (S) and a sixth curved surface (S). The first to the sixth curved surfaces are sequentially arranged in the transmission direction of the incident light, and the curvature radii of the first to the sixth curved surfaces are sequentially &#x2212;200&#xb1;5%, &#x2212;100&#xb1;5%, &#x2212;80&#xb1;5%, &#x2212;150&#xb1;5%, &#x2212;100&#xb1;5% and &#x2212;70&#xb1;5% in a unit of millimeter. By means of the lens module, the printing efficiency of the 3D printer is high and it is convenient to carry out printing of ultra-large workpieces.

3D printer and lens module used by same

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Shenzhen, China

Yunfeng Gao