Sunedison Semiconductor Limited (uen201334164h)

Sunedison Semiconductor Limited

Yunbiao Xin

Sumeet S Bhagavat

Roland R Vandamme

Peter D Albrecht

Carlo Zavattari

Alex Chu

Ichiro Yoshimura

A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive.

Center flex single side polishing head having recess and cap

Methods are disclosed for determining mounting locations of ingots on a wire saw machine. The methods include measuring a test surface of a test wafer previously sliced by the wire saw machine from a test ingot to calibrate the system. A magnitude and a direction of an irregularity of the measured test surface of the test wafer is then determined. The mounting location is then determined for another ingot to be mounted on the ingot holder based on at least one of the magnitude and direction of the irregularity of the measured test surface of the test wafer.

Methods for mounting an ingot on a wire saw

Growing community of inventors

Palo Alto, CA, United States of America

Yunbiao Xin