Techwing Co., Ltd.

Yun Sung Na

In Gu Jeon

Tae Hung Ku

Jae Gyun Shim

Dong Hyun Yo

Dong Han Kim

Hyun Cheol Song

Bong Soo Kim

Tae-Hung Ku

Dong-Hyun Yo

Cheul-Gyu Boo

Jung Woo Hwang

Choung Min Joung

Doo-Woo Kim

Jae Woo Jang

Hyun Jun Yoo

A clamping apparatus for clamping a plurality of Hi-Fix boards arranged in a row, includes at least one rotational clamping unit installed to clamp facing end sides of the two or more Hi-Fix boards together, and a plurality of clamping units installed to clamp end sides of the Hi-Fix boards other than the facing sides thereof. The rotational clamping unit includes a clamper installed to rotate about a fixed rotation point to clamp or release the claming of the facing end sides of the two or more Hi-Fix boards, and a driving unit for providing a rotational force to the clamper.

Hi-fix board clamping apparatus for use in test handler

A pick-and-place module for test handlers is disclosed that includes a main body and a kit. The main body forms vacuum paths therein and the kit also forms vacuum passages therein. The kit is detachably mounted to the main body in a hook coupling manner. The pick-and-place module can be applied to all customer trays having different loading capabilities when only the kit of the pick-and-place module needs to be replaced, so there is no need to manufacture the entire pick-and-place module and this reduces manufacturing costs. The pick-and-place module can reduce the amount of resources to be replaced and reduce the replacement time since the kit can be easily removed from the main body of the pick-and-place module in a hook manner.

Pick-and-place module for test handler

A unit for opening an insert of a test tray which comprises an accommodating space for accommodating a semiconductor device and a support for supporting the semiconductor device accommodated in the accommodating space, the unit includes a body, a pair of opening devices provided in the body to open the insert, and a positioning guide unit protruding to be inserted into an accommodating space for a semiconductor device when opening the insert and supporting the semiconductor device that is transferred into the accommodating space to be spaced upward apart from a support provided in the accommodating space.

Unit for opening insert for test tray and method of mounting semiconductor device using the same

In a side-docking type test handler, a descending mechanism lowers a horizontally postured test tray, which has been transferred into a soak chamber, down to a descent finish position and a vertical posture changing mechanism changes the posture of the test tray, which has been lowered to the descent finish position, from the horizontal state to a vertical state, to transfer the test tray into a test chamber. Further, a horizontal posture changing mechanism changes the posture of the test tray in the test chamber from the vertical state to the horizontal state while transferring the test tray to an ascent start position in a desoak chamber.

Side-docking type test handler and apparatus for transferring test tray for same

A pick and place apparatus includes a plurality of device holing elements in a predetermined arrangement; a power supply mechanism for supplying a power for controlling a horizontal pitch between the plurality of device holding elements; a power transmission mechanism for delivering the power from the power supply mechanism to the plurality of device holding elements as a translational force in a horizontal direction; a first linear motion guide mechanism for guiding horizontal movements of some of the plurality of device holding elements; and a second linear motion guide mechanism disposed below the first linear motion guide mechanism, for guiding horizontal movements of the other device holding elements. The plurality of device holding elements are slidably coupled to the first and the second linear motion guide mechanism alternately.

Pick and place apparatus

A pick and place apparatus includes a 1to an ndevice holding element arranged in a lengthwise direction, every one of the 1to the ndevice holding element being connected to its neighboring one(s) of the 1to the ndevice holding element by means of at least one pitch setting ring; a belt having a first coupling part at an upper part thereof for being coupled to the 1device holding element and a second coupling part at a lower part thereof for being coupled to the ndevice holding element; and a driven pulley and a differential pulley. The driven and the differential pulley are rotated by being engaged with the belt to move the 1and the ndevice holding element such that the 1device holding element moves in a direction opposite to the ndevice holding element.

A test handler includes a loading unit for loading semiconductor devices from customer trays onto a test tray; a test chamber for performing a test for the semiconductor devices loaded on the test tray; a pushing unit having at least one pushing member for pushing the test tray located in the test chamber to be tested, and a press unit for operating the pushing member; a position control unit for adjusting a position of the pushing member to compensate a deviation between the pushing member and the test tray due to a thermal expansion or contraction of any one of the pushing member and the test tray; and an unloading unit for unloading the semiconductor devices loaded on the test tray onto the customer trays after a test for the semiconductor devices is completed.

Test handler

Operation methods of test handler are disclosed. The pick-and-place apparatus picks up semiconductor devices from first loading compartments arrayed in a matrix on a first loading element, moves, and places onto second loading compartments arrayed in a matrix on a second loading element. Pickers of the pick-and-place apparatus pick up the semiconductor devices from the first loading compartments and place them selectively onto a plurality of adjacent odd rows or a plurality of adjacent even rows of the second loading compartments during one operation. The pick-and-place apparatus includes a relatively large number of the pickers, preferably arrayed in a matrix, and thus performs loading and unloading of semiconductor devices at a relatively high speed.

Operating method of test handler

A test handler () of the present invention includes a main body, a window () formed on a surface of the main body and having a size corresponding to a Hi-Fix board of M&#xd7;N array (where M and N represent an integer greater than a value of =), a cover () detachably fixed to the main body t close a part of the window and convert the window into the test site having a size corresponding to a [M&#x2212;A)&#xd7;(n&#x2212;B)] Hi-Fix board (where A is an integer equal to or greater than 0 but smaller than M, and B is an integer having a value other than 0). In the test handler, the size of window is easily modified to adapt that of the Hi-Fix board of M&#xd7;N array by closing or opening a part of the window using the cover. Therefore, the test handler is capable of applying Hi-Fix boards having different sizes.

Test handler having size-changeable test site

A test handler is disclosed. First and second gripping blocks for respective front and rear test trays to be transferred along a circulation path move together in a circulation direction, but move independently in a direction perpendicular to the circulation path and grip and release independently. The test trays can be transferred by a single power source and interference between an assisting a test and a transferring can be minimized.

Test tray transferring apparatus for a test handler, test handler, and method of transferring test trays for a test handler

The present invention relates to a test tray for a test handler. According to this invention, there is disclosed a technique that an insert loaded in a loading part which is arranged in a matrix pattern in a frame of the test tray allows an amount and direction of free movement thereof to be determined in accordance with a location of the loading part, where the insert is loaded, on the matrix, thereby enabling a thermal expansion or contraction of a match plate or the test tray to be compensated.

Method for transferring test trays in a side-docking type test handler

Test tray for test handler

A pusher for a match plate of a test handler is disclosed which assists a tester to test the produced semiconductor devices. The pusher includes: a body part installed to an installation plate; and a pushing part that extends forward from a front side of the body part, for pushing a semiconductor device placed on an insert of a test tray. The pusher forms: an air through hole that extends through from a rear side of the body part to the front side of the pushing part, for guiding air of a certain temperature, supplied to the rear side of the body part from a duct, to be supplied to the semiconductor device; and at least one or more air outflow holes that extend through from at least one side of the pushing part and communicate with the air through hole, for allowing part of the air supplied from the duct through the air through hole to flow out to a test site. The pusher can reduce the temperature deviation of semiconductor devices at the test site.

Growing community of inventors

Cheonan-si, South Korea

Yun Sung Na