Samsung Electro-Mechanics Co., Ltd.

Yun Sung Kang

Seung Mo Lim

Kyo Yeol Lee

Hai Joon Lee

Jeong Suong Yang

Kwang Su Kim

Yun Hee Kim

Jeong Il Lee

Pil Joong Kang

Sun Hwa Kim

Hoe Chul Jung

Won Jun Na

Dong Joon Oh

Byeong Gyu Park

Min Jung Cho

Jong Hyeong Song

Ji Hye Nam

Jong Woon Kim

Jung Won Lee

Seung Hun Han

Sung Sun Kim

Seung Joo Shin

Ho Phil Jung

Tae Kyung Lee

Sang Jin Kim

Sung Woo Han

Hwa Sun Lee

Hyun Ho Shin

Won Kyu Jeung

Jin Suk Son

Ran Hee Shin

Byung Kun Kim

In Young Kang

Woong Do Jung

Yu Hong Oh

Eun Tae Park

Nam Jung Lee

Tae Gyun Kwon

Eung Seok Lee

Su Yeon Lee

Ji Hong Jo

Sung Soo Kim

Doo Young Kim

Sang Jong Lee

Sung Jun Lee

Tae Joon Park

Heung Woo Park

Jae Young Na

Jung Eun Noh

Seung Heon Han

Jin Hyung Lim

Kyung Ryul Lee

Sung Wook Kim

Jun Oh Kim

Hyun Kee Lee

Min Kyu Choi

Won Mi Choi

Jae Eun Heo

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body. A ceramic layer is disposed between the dielectric layer and the internal electrode. When an area ratio occupied by pores with respect to the ceramic layer is Sp1 and an area ratio occupied by pores with respect to the dielectric layer is Sp2, Sp1 is less than 5%, and Sp1<Sp2 is satisfied.

Multilayer electronic component and method of manufacturing multilayer electronic component

A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer, and an external electrode disposed on the body. The internal electrode includes nickel (Ni) and yttrium (Y), and an average thickness of the internal electrode is 50 nm or more to 250 nm or less.

Multilayer electronic component

A multilayer electronic component includes a body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on the body, wherein the internal electrode includes Ni, Sr, and Ru, and an average content of (Sr+Ru)/(Ni+Sr+Ru) is more than 0 wt and less than 8.40 wt.

Multilayer electronic component and method of manufacturing the same

A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.

Multilayer capacitor and method of manufacturing the same

A multilayer electronic component includes a body including a capacitance formation portion including dielectric layers and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion, facing each other in the first direction, and having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and external electrodes disposed on the third and fourth surfaces. The internal electrodes and the dielectric layers protrude more outwardly than the cover portion in the second direction, and a groove is disposed at an end of the dielectric layer in the second direction.

A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the plurality of internal electrodes, wherein each of the plurality of internal electrodes includes a plurality of nickel layers, and a heterogeneous material layer provided between the plurality of nickel layers.

A multilayer electronic component includes a body having a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The body has a hexahedral shape. A first external electrode includes a first connection portion disposed on a third surface, and first and third band portions extending from the first connection portion respectively onto a portion of a first and a second surface. A second external electrode includes a second connection portion disposed on a fourth surface, and second and fourth band portions extending from the second connection portion respectively onto a portion of the first and second surfaces. An insulating layer including an oxide containing hafnium is disposed on the first and second connection portions and covers the second surface and the third and fourth band portions. First and second plating layers are disposed respectively on the first and second band portions.

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer interposed therebetween in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein 0.46 to 1.08 at % is a range of an indium (In) content compared to nickel (Ni) and indium (In) contents in a surface layer portion of the internal electrode.

Multilayered electronic component

Multilayer capacitor

A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.

Capacitor component including indium and tin, and method of manufacturing the capacitor component

An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Acoustic resonator and method of manufacturing the same

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Electronic element package and method for manufacturing the same

Growing community of inventors

Suwon-si, South Korea

Yun Sung Kang