Lg Innotek Co., Ltd.

Yun Soo Song

Yon Tae Moon

Kwang Kyu Choi

Hwan Hee Jeong

Koh Eun Lee

Ga Yeon Kim

Sang Hyuk Lee

A light-emitting device package according to an embodiment may include a body; N (herein, N denotes a positive integer of 5 or more) upper pads disposed on the body to be spaced apart from each other; N&#x2212;1 light-emitting device chips respectively arranged on N&#x2212;1 upper pads among the N upper pads; and a plurality of first wires for electrically connecting the N&#x2212;1 light-emitting device chips and the N upper pads to each other by at least one of a plurality of wiring structures.

Light-emitting device package

According to an embodiment, a light-emitting device is disclosed. The disclosed light-emitting device comprises: a substrate having a body and first and second lead electrodes on the body; a light-emitting chip arranged on the second lead electrode and electrically connected to the first and second lead electrodes; a phosphor film arranged on the light-emitting chip; a reflective member arranged on the outer peripheries of the light-emitting chip and the phosphor film, respectively; and an optical lens, which is arranged on the phosphor film and on the reflective member, and which has a lens portion that has an aspherical shape.

Light-emitting device and lighting device having same

Provided are a light emitting device package and a lighting system including the light emitting device package. The light emitting device package includes a package body, at least one electrode on the package body, a light emitting device on the package body, a reflective structure around the light emitting device on the package body and a lens on the light emitting device and the electrode.

Light emitting device package and lighting system including the same

Disclosed is a method for manufacturing a fluorescent material. The method includes: Disclosed is a light emitting device. The light emitting device includes:

Growing community of inventors

Seoul, South Korea

Yun Soo Song