Intel Corporation

Yun Rou Lim

Khang Choong Yong

Stephen H Hall

Bok Eng Cheah

Jackson Chung Peng Kong

Wil Choon Song

Ying Ern Ho

Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The package substrate includes a plurality of conductive bumps on a surface of the conductive line, where the conductive bumps are conductively coupled to the conductive line, and a solder resist over the conductive line and the dielectric. The surface of the conductive line may be a bottom surface, where the conductive bumps are below the conductive line and conductively coupled to the bottom surface of the conductive line, and where the conductive bumps may be embedded in the dielectric. The surface of the conductive line may be a top surface, where the conductive bumps are above the conductive line and conductively coupled to the top surface of the conductive line, and wherein the conductive bumps are embedded in the solder resist.

Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission

Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

Pattern-edged metal-plane resonance-suppression

Apparatus and methods are provided for ameliorating distortion issues associated with a conductor that passes over a void in a reference plane. In an example, the conductor can include a first part routed over a major surface of a first side of the reference plane structure and that approaches a first edge of the reference plane structure with a first trajectory, a second part routed over the major surface of a second side of the reference plane structure and that approaches a second edge of the reference plane structure with a second trajectory in-line with the first trajectory, and a third portion connecting the first portion with the second portion and having a third trajectory departing from the first trajectory and the second trajectory, the third portion configured to span the void.

Transmission line design with routing-over-void compensation

A fold in a semiconductor package substrate includes an embedded device that includes orthogonal electrical coupling through the package substrate by a bond-pad via that is configured to couple to a semiconductive device that is mounted on the semiconductor package substrate. The semiconductive device is coupled to the embedded device with the orthogonal electrical coupling.

Folded semiconductor package architectures and methods of assembling same

Apparatus and methods are provided for ameliorating distortion issues associated with a conductor that passes over a void in a reference plane. In an example, the signal conductor can include a first part routed over the major surface of a first side of the reference plane structure on a first side of the void and that approaches a first edge of the reference plane structure with a first trajectory, a second part routed over the major surface of the reference plane structure on a second side of the void and that approaches a second edge of the reference plane structure with a second trajectory, and a third portion connecting the first portion with the second portion, the third portion spanning the void, and having a plurality of spurs extending from a body of the third portion.

Growing community of inventors

Bayan Lepas, Malaysia

Yun Rou Lim