Advanced Semiconductor Engineering, Inc.

Yun-Lung Chang

Chia-Ming Chang

Ming-Wei Sun

Kuang-Lin Lo

Wei-Chih Wang

Chin-Sung Lee

Yu-Chang Tsai

A substrate board and a manufacturing method of a package structure are provided. The substrate board includes a first surface, a die-attaching area, a cutting area, a plurality of first pads and a first solder mask. The die-attaching area for attaching a die is located on the first surface. The first pads are disposed on the first surface. The first solder mask is partially disposed on the first surface to expose part of the cutting area and the first pads. The first solder mask is divided into a first inner area and a first outer area via the cutting area. The die-attaching area and the first pads are located in the first inner area. Wherein, part of the first mask is located on the cutting area for connecting the first inner area and the first outer area.

Substrate and manufacturing method of package structure

A degating device applied to remove a cull between two chip carriers comprises a lower mold, an upper mold, a blowing-opening, and a cooling pipe. The lower mold is used to load chip carriers and has a plunger set for propping and degating the cull. The upper mold is fit in with the lower mold tightly. The airflow blown out from the blowing-opening blows to lower the temperature around the chip carriers. The cooling pipe is disposed according to the position of the blowing-opening to cool down the temperature around the blowing-opening. The two chip carriers are disposed on the lower mold and fixed between the upper mold and the lower mold while the upper mold combines with the lower mold. By changing the position of the plunger set relative to the upper mold and the lower mold, the cull can be stripped from the chip carriers.

Degating device

A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.

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Kaohsiung, Taiwan

Yun-Lung Chang