Tyco Electronics (shanghai) Co., Ltd.

Te Connectivity Corporation

Shenzhen Ami Technology Co., Ltd

Kunshan League Automechanism Co.. Ltd.

Te Connectivity Services Gmbh

Measurement Specialties (chengdu) Ltd.

Te Connectivity Solutions Gmbh

Zing Semiconductor Corporation

Chinese Academy of Sciences

Koninklijke Philips Corporation N.V.

Measurement Specialties (china) Ltd.

Tyco Electronics Corporation

Te Connectivity Germany Gmbh

Measurement Specialties, Incorporated

Meas France

Yun Liu

Lvhai Hu

Dandan Zhang

Yingcong Deng

Roberto Francisco-Yi Lu

Qinglong Zeng

Fengchun Xie

Lei Zhou

Zhiyong Dai

Jian Cao

An Yang

Haidong Wu

Qian Ying

Lan Gong

Liming Xin

Hui Xiao

Yong Yan

Kok Wai Wong

Yuting He

Zhongying Xue

Xing Wei

Wei Kang

Songping Chen

Lin Ye

Sun Kyu Pak

Changjun Wang

Yang Zhou

Gang Wang

Tao Li

Wei Chen

Xun Wang

John Edward Steck

Tao Wei

Michael Andrew Oar

Leonard Henry Radzilowski

Shuwei Pan

Hanyi Huang

Sebastian Wiechert

Andrzej Przybylski

Jaroslaw Kowalski

Jaroslaw Grzebski

Xiaochen Yu

Chingming Liu

Xiangyou Hou

Yujie Huang

Dusan Golubovic

Mengming Zhu

Chengsheng Ku

Yuhua Lee

Qiang Yu

Yuan Yao

Minghao Li

Yuanbin Wen

Weimin Shen

Zhan Li

Hamza Boumeddane

Lin Yao

Roberto-Francisco Yi Lu

Karlheinz Glaser

Nicolas Christophe R Pecquet

Ning Zhang

Yanbing Fu

Yumin Lan

Wenzhao Liao

Qiyu Cai

Jeffrey Rochette

Roberto Franciso-Yi Lu

Eric Broch

Roberto Francisco - Yi Lu

The invention provides a method of detecting crystallographic defects, comprising: sampling wafer of an ingot in complying with a predetermined wafer sampling frequency; identifying crystallographic defects of the wafer to show the crystallographic defects of the wafer; characterizing observation of the crystallographic defects of the wafer and extracting a value characterizing the crystallographic defects; through a result of characterizing the crystallographic defects, obtaining a radial distribution of density of the wafer and categorizing the crystallographic defects; and obtaining an isogram of the crystallographic defects of the wafer to show a crystallographic defect distribution of the whole ingot according to the value characterizing the crystallographic defects and categories of the crystallographic defects. It is no need to break the ingot to obtain the crystallographic defect distribution of the whole ingot, through which the technology for growing the ingot may be effectively adjusted to obtain the ingot with required characteristics of defect.

Method of detecting crystallographic defects and method of growing an ingot

Cat litter box

The present application provides a method for characterizing defects in silicon crystal comprising the following steps: etching a surface of the silicon crystal to remove a predicted thickness of the silicon crystal; conducting a LLS scanning to a surface of the etched silicon crystal to obtain a LLS map of the surface, a LSE size of defects, and defect bulk density; based on at least one of the LLS map of the surface, the LSE size of defects and the defect bulk density, determining a type of defect existing in the silicon crystal and/or a defect zone of each type of defect on the surface. By applying the method, the characterizing period and the characterizing cost can be reduced, plural defects such as vacancy, oxygen precipitate and dislocation can be characterized simultaneously, the characterizing accuracy can be enhanced, and the defect type and the defect zone can be determined with high reliability. In addition, the method can be applied to all crystal defect types, is easy to operate, and is an environmentally friendly method for determination of grown-in defects.

Method for characterizing defects in silicon crystal

A semiconductor crystal growth method and device are provided. The method comprises: obtaining an initial position of a graphite crucible when used in a semiconductor crystal growth process for the first time; obtaining a current production batch of the graphite crucible which characterizes a number of times of growth processes performed by the graphite crucible so far; and loading polysilicon raw materials into a quartz crucible sleeved in the graphite crucible based on the current production batch, wherein a total weight of the materials is called a charging amount, and the charging amount is adjusted based on the current production batch to keep an initial position of a silicon melt liquid surface in the quartz crucible stable while keeping the initial position of the graphite crucible unchanged. The present invention ensures the stability of each parameter in the crystal pulling process, and enhances the crystal pulling speed and quality.

Semiconductor crystal growth method and device

A cable bundle taping device adapted to wind a tape on a coiled cable bundle includes a support frame, a conveying device mounted on the support frame and adapted to convey the tape to a standby position, a first driving wheel rotatably mounted on the support frame and having a slot extending radially inward from an outer edge of the first driving wheel, and a tape binding mechanism arranged on a side of at least one sidewall of the first driving wheel near a bottom of the slot and opposite to the tape in the standby position. The coiled cable bundle is bonded to an end of the tape at the standby position and pushed to the bottom of the slot. The tape is wound on the coiled cable bundle by rotating the tape binding mechanism under driving of the first driving wheel.

Cable bundle taping device

An assembly system includes a robot, a first gripper mounted on the robot, the first gripper gripping a first housing, and a first clamping device clamping a cable and a contact connected to an end of the cable. The robot moves the first gripper and assembles the first housing gripped by the first gripper onto the contact held by the first clamping device.

Assembly system

A cable straightening device includes a plurality of cable straightening units connected in series. Each of the cable straightening units includes a base, a pair of rows of rollers mounted on the base and cooperating with each other to define a pressing path extending in a row direction, and a mounting frame disposed on at least one end of a pair of opposite ends of the base in the row direction. A cable is pressed by the rows of rollers while passing through the pressing path. Any two adjacent cable straightening units are assembled together at the mounting frame of each so that center lines of the pressing paths of two adjacent cable straightening units are aligned with each other.

Cable straightening device

A metal foil flaring apparatus includes a frame, a flaring mechanism mounted on the frame and having a flaring mouth adapted to open and close, and a first driver mounted on the frame and adapted to drive the flaring mouth to open and close. The flaring mouth has a cone shape gradually contracted toward a front end of the flaring mouth. The front end of the flaring mouth is adapted to be forwardly inserted in a first direction between an inner insulation layer of a cable and a metal foil wrapped around the inner insulation layer when the flaring mouth is closed, flaring the metal foil outwardly into the cone shape.

Metal foil flaring apparatus

A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.

Welding system

An assembly system includes a positioning unit adapted to clamp and position a cable, a supply unit adapted to supply a connector, and an insertion unit adapted to insert an end of the cable into the connector by moving the connector. The supply unit includes a conveyor belt having a side to which ends of a plurality of connectors in a row of connectors are connected, a cutting device configured to cut each connector of the row of connectors from the conveyor belt, and a conveyor configured to move the conveyor belt, so as to move the connectors individually to the cutting device.

A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.

Wire fixation apparatus and soldering method

A joint crimping apparatus adapted to crimp a joint to an end of a cable includes a base, a fixed die detachably mounted on the base, a movable die configured to reciprocate relative to the fixed die, and a separation mechanism. The fixed die has a first groove adapted to receive a portion of a joint in an un-crimped state. The movable die has a second groove adapted to cooperate with the first groove to crimp the joint to the end of the cable. The separation mechanism is configured to remove the cable jammed in the second groove and crimped with the joint from the second groove.

Joint crimping apparatus

A device for transferring components includes a transfer assembly and a drive assembly. The transfer assembly has a transfer track transferring a plurality of components therein. The transfer track has an operation position for operating the components. The drive assembly has a first drive mechanism transferring a first set of components of the components at the operation position in the transfer track and a second drive mechanism transferring a second set of components of the components at the operation position in the transfer track. The first drive mechanism and the second drive mechanism in turn drive the first set of components and the second set of components, continuously transferring the components.

Device and method for transferring components

A positioning device that has a support table, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically at the top of each sliding block, a base on which the support table is supported, a cylinder in the base, a ball in the cylinder, a piston rod slidably mounted in the cylinder and pushing the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism that drives the piston rod to move downward in the vertical direction to allow the two pairs of sliding blocks to be moved toward each other in the first horizontal direction and the second horizontal direction, so that the positioning plates drive the electronic device in the positioning slot to move toward a center of the opening.

Positioning device

Disclosed a heat shield structure for a single crystal production furnace, which is provided above a melt crucible of a single crystal production furnace and comprises an outer housing and a heat insulation plate disposed within the outer housing. A bottom outer surface of the outer housing faces an interior of the melt crucible, and an angle formed between a plane in which the heat insulation plate is located and a plane in which a bottom of the outer housing is located is an acute angle and faces an outer surface of single crystal silicon. The heat shield design is changed, a heat absorbing plate is additionally provided for transferring heat absorbed to the single crystal silicon, a heat channel is formed in the heat shield, so that a pulling rate is controlled, which improves radial mass uniformity of the single crystal silicon.

Heat shield structure for single crystal production furnace and single crystal production furnace

Growing community of inventors

Shanghai, China

Yun Liu