Intel Corporation

Yun Ling

Xiang Li

Hao-Han Hsu

Kuan-Yu Chen

Daniel T Tong

Jackson Chung Peng Kong

Wei-Lun Kane Jen

Chung-Hao Chen

Li-Sheng Weng

Scott L Noble

Jason A Mix

Chi-Te Chen

Olivia Chen

Bok Eng Cheah

Kai Xiao

Jiangqi He

Khang Choong Yong

Howard L Heck

Michael W Leddige

Gong Ouyang

Thomas G Ruttan

John M Lynch

Yinan Wu

Daniel Willis

Alok Tripathi

Mohd Muhaiyiddin Bin Abdullah

Kai Wang

Lu-Vong T Phan

Shyamjith Mohan

Guixiang Tan

Chia Voon Tan

Daniel L Tong

Kent E Mallory

Thai Dan Tong

Daniel (Thai) Tong

Thai (Daniel) Tong

Cary D Cottrell

Brent A Hill

Wei Xu

Kuan-yu Chen

Techniques and mechanisms for mitigating the effect of signal noise on communication via an interconnect. In an embodiment, a substrate includes an interconnect and a conductor which has a hole formed therein. Portions of the interconnect variously extend over a side of the conductor, wherein another recess portion of the interconnect extends from a plane which includes the side, and further extends at least partially into the hole. The configuration of the recess portion extending within the hole may contribute to an impedance which dampens a transmitter slew rate of the communication. In an embodiment, a total distance along a path formed by the interconnect is equal to or less than 5.5 inches.

Device, system and method to promote the integrity of signal communications

A microelectronic structure may be formed comprising a microelectronic package having a plurality of interconnects and a microelectronic substrate including an upper metallization layer and a solder resist structure, wherein the solder resist structure includes a first structure which forms an electrical connection between a first interconnect of the plurality of interconnects of the microelectronic package and the upper metallization layer of the microelectronic substrate, and wherein solder resist structure includes a second structure which prevents second interconnect of the plurality of interconnects of the microelectronic package from making electrical contact with the upper metallization layer.

Solder resist layer structures for terminating de-featured components and methods of making the same

In accordance with some embodiments, a high speed connection may be implemented using pogo-pins. The use of pogo-pins may be advantageous because accurate alignment is not required, connection force is generally lower than with other connections and appearance is often highly advantageous. Through the use of a moveable metal shield, an advantageous high speed connection for high speed signaling may be implemented between the two devices.

Pogo-pins for high speed signaling

A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.

Retention mechanism for shielded flex cable to improve EMI/RFI for high speed signaling

Techniques for routing signal traces in a circuit board are described. An example of an electronic device in accordance with the described techniques includes a circuit board comprising a plurality of conductive layers. The conductive layers include a signal layer and a reference plane. The signal layer includes signal traces and the reference plane includes an additional signal trace.

Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces

Systems and methods provided may involve arranging a first differential pair and a second differential pair and adjusting spacing arrangements between the first differential pair and the second differential pair to minimize crosstalk.

Minimizing crosstalk in a data transfer device

Methods and systems to support input output (IO) communications may include an IO connector having a housing with surfaces defining a paddle card region, and a set of compressible contacts extending vertically through the housing into the paddle card region. In addition, an IO interconnect can include a cable portion and at least one end portion coupled to the cable portion. The end portion may include a paddle card having a circuit board with a set of contacts disposed on a bottom surface of the circuit board. The end portion can also include an asymmetric metal shell having a configuration that encloses at least a portion of the paddle card and exposes the set of contacts.

High bandwidth connector for internal and external IO interfaces

In an embodiment, a connector such as an edge connector includes a connector housing, a first set of pins configured within the housing and having first ends to couple to corresponding signal lines of a first circuit board and second ends to couple to corresponding signal lines of a mating connector of a second circuit board, and a conductive material adapted to the housing to reduce interference caused by one or more sources of interference. Other embodiments are described and claimed.

Shielding a connector to reduce interference

Embodiments of the invention use a small piece of flex or rigid PCB as the cable plug. The wires of the cable are soldered onto the pads on the PCB with the pads so arranged that all the ground pads are tied together without needing a separate grounding bar. The signal and GND pads are so aligned such that minimum strip length is required for soldering and the symmetry of the differential signals is maintained.

Innovative cable termination scheme

An electronic system includes a system board, a connector mounted on the system board, an electronic card attached to the connector, the card overhanging the connector at least on an inward end of the card, and a guide secured to the system board and spaced from the connector, wherein the guide is adapted to inhibit lateral movement of the card. The guide includes a latch adapted to inhibit removal of the electronic card from the connector.

Multi-axis retention mechanism

In some embodiments, an electronic circuit card includes an edge connector positioned along an edge of the electronic circuit card, wherein the edge connector includes a conductive finger on an outer layer of the electronic circuit card, and a via positioned within the conductive finger, wherein the via electrically connects the conductive finger to another layer of the electronic circuit card. In some embodiments, an electronic circuit card includes an edge connector positioned along an edge of the electronic circuit card, wherein the edge connector includes a conductive finger having a stepped shape. In some embodiments, a connector housing defines a slot, and a plurality of contacts may be disposed inside the housing and positioned along at least one side of the slot, wherein the contacts include a contact surface which is relatively wider at respective interface points on the contacts. Other embodiments are disclosed and claimed.

High performance edge connector

In one embodiment of the invention, the apparatus includes a socket connector to connect to a backplane to receive an electronic device. The socket connector includes a plurality of pairs of signal contacts to receive signals from the electronic device, and a plurality of ground frames to ground the electronic device. The ground frames are to connect to a ground plane of the electronic device. The socket connector also includes a set of one or more ground pins to connect to the ground plane, wherein each one of the set is between each of the pairs of signal contacts.

Add-in card to backplane connecting apparatus

In one embodiment of the invention, the apparatus includes a socket connector. In one embodiment of the invention, the socket connector is to connect to a circuit board. The socket connector includes a housing to contain contacts, a socket disposed within the housing to receive an add-in card, and a retaining tab coupled to the housing to retain the add-in card in the socket. The retaining tab includes a lobe to mate with a retaining notch of the add-in card.

Integrated add-in card retention mechanism

According to some embodiments, an electrical connector may comprise a first end and a second end, wherein the electrical connector defines a channel. In some embodiments, one or more electrical contacts may be disposed within the channel. Further, a fixed retention mechanism may be coupled to the first end of the electrical connector, wherein the fixed retention mechanism is to couple to a detent portion of an electrical component.

Growing community of inventors

Portland, OR, United States of America

Yun Ling