Samsung Electronics Co., Ltd.

Yun Jung Jee

Chung Sam Jun

Sung Yoon Ryu

Yu Sin Yang

Young Hoon Sohn

Duck Mahn Oh

Min Ho Rim

A scanning probe inspector comprises: a probe that includes a cantilever and a tip whose length corresponds to a depth of a trench that is formed in a wafer; a trench detector that acquires location information of the trench using the probe, where the location information includes depth information of the trench; a controller that inserts the tip into a first point where there exists a trench based on the location information of the trench, and moves the tip through the trench using the location information of the trench; and a defect detector that detects a presence of a defect in a sidewall of the trench as the tip is moved through the trench.

Scanning probe inspector

A method of testing can include providing a first beam having a first focal length and a second beam having a second focal length that is less than the first focal length to a stage region to provide a first reflected beam and a second reflected beam from the stage region. The first reflected beam can be detected among the first reflected beam and the second reflected beam reflected from the stage region. The second reflected beam can be detected among the first reflected beam and the second reflected beam reflected from the stage region. A first image can be generated from the first reflected beam and a second image can be generated from the second reflected beam. The first image and the second image can be combined to provide a 3D image.

Systems and methods of testing semiconductor devices using simultaneously scanning of a plurality of regions therein and methods of forming semiconductor devices using the same

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Seongnam-si, South Korea

Yun Jung Jee