Intel Corporation

Baidu USA LLC

Apollo Autonomous Driving USA LLC

Beijing Baidu Netcom Science Technology Co., Ltd

Yun Ji

Zhenwei Yu

Xingjian Cai

Harry G Skinner

Howard L Heck

Ke W Wang

Paik Wen Ong

Steve Y Chang

Jimmy Huat Since Huang

Congshi Huang

Zhiyuan Li

Herh Nan Chen

Dongpo Zou

Mohammad Ibrahim Khan

In one embodiment, a method for controlling PCIe devices on an autonomous driving system (ADS) of an autonomous driving vehicle (ADV) is disclosed. The method includes scanning PCIe ports of the ADS to discover PCIe device(s) mounted on the ADS. Next, a comparison is performed between a list of the discovered PCIe device(s) and an expected list of PCIe devices for the ADS. Next, an offline PCIe device is determined based on the comparison, the offline PCIe device corresponding to a PCIe device that is present in the expected list of PCIe devices but not in the list of the discovered PCIe devices. Then a device reset command is transmitted to a programmable logic device that manages power for PCIe devices of the ADS to reset the offline PCIe device, wherein the programmable logic device generates a reset control signal for the offline PCIe device to reset the PCIe device.

Peripheral component interconnect express device reset for autonomous driving systems

In one embodiment, a system captures a first frame and a second frame for an environment of an autonomous driving vehicle (ADV) from at least a first and a second cameras mounted on the ADV. The system determines at least two points in the first frame having corresponding points in the second frame. The system determines distance and angle measurement information from the first camera to the at least two points and from the second camera to the corresponding points. The system determines actual positioning angles of the first and second cameras with respect to an orientation of the ADV based on the distance and angle measurement information and pixel information in the first and second frames. The actual positioning angles are used to compensate misalignments in positioning angles for the first and second cameras.

Video camera calibration refinement for autonomous driving vehicles

In one embodiment, a printed circuit board (PCB) includes a substrate, one or more signal layers including a first signal layer, a first segment of a transmission line disposed at the first signal layer electrically coupling a first location to a second location, and a first signal via disposed at the second location. The PCB circuit includes a second segment of the transmission line disposed at the first signal layer electrically coupling a third location to a fourth location and a second signal via disposed at the third location. The PCB includes a power-over-cable circuit disposed on a first surface of the substrate and electrically coupled to the first and second signal via, where the first and second segments carry a signal of an image sensor and the first segment carries power from the power-over-cable circuit to the image sensor, where the image sensor is used for an autonomous vehicle.

Power over cable via stub effect mitigation method and system for camera interface of high speed printed circuit board for autonomous vehicles

A printed circuit board includes first and second surfaces, first and second layers, and first and second vias. The first via extends from a first layer to the second surface and includes a first portion that is on a conductive path between the first layer and the second layer and a second portion that is not on the conductive path. A length of the first portion of the first via is greater than that of the second portion of the first via. The second via extends from the second surface to the second layer. The second via includes a first portion that is on the conductive path between the first layer and the second layer and a second portion that is not on the conductive path. A length of the first portion of the second via is greater than that of the second portion of the second via.

Techniques for high-speed signal layer transition

An electronic apparatus and an electronic system may include a first power delivery network (PDN) and a second PDN. The first PDN may include a first inductor as a segment of a power rail of the first PDN, while the second PDN may include a second inductor as a segment of a power rail of the second PDN. The first inductor and the second inductor may form a magnetically coupled inductor. The magnetically coupled inductor may provide migrated impedance Zto the first PDN induced by the magnetically coupled inductor. The migrated impedance Zto the first PDN may help the first PDN to reduce its voltage noise. Other embodiments may be described and/or claimed.

Voltage noise reduction of power delivery networks for integrated circuits

Techniques and mechanism to provide signal communication with vias variously extending in a substrate. In an embodiment, a first capacitor and a second capacitor are coupled in parallel with one another each between a first via and a second via, the first via to receive a first signal. Respective portions of the first signal are concurrently communicated from the first via to the second via with the first capacitor and the second capacitor, respectively. In another embodiment, the first signal is one signal of a differential signal pair further comprising a second signal which is received at a third via. Respective portions of the second signal are concurrently communicated from the third via to a fourth via with a third capacitor and a fourth capacitor, respectively. The third capacitor and the fourth capacitor are coupled in parallel with one another each between the third via and the fourth via.

Coupling structures for signal communication and method of making same

A system includes a chassis having at least one wall, the chassis housing electrical components and a layer of flexible foam electromagnetic interference (EMI) emission absorption material covering an interior surface of the wall. A system also includes a chassis containing slots, the chassis housing electrical components and a layer of flexible foam electromagnetic interference (EMI) emission absorption material covering at least one of the slots.

Growing community of inventors

San Jose, CA, United States of America

Yun Ji