Center for Advanced Meta-materials

Korea Institute of Machinery & Materials

Yun Hwangbo

Hak Joo Lee

Jae Hyun Kim

Jae-Hyun Kim

Bongkyun Jang

Kwang Seop Kim

Byung-Ik Choi

Bong Kyun Jang

Kwangseop Kim

Sang Min Kim

Yeon Woo Jeong

Seong Min Hong

Chang Hyun Kim

Chan Soo Kim

Jung Yup Kim

Hyun June Jung

Se Jeong Won

Seung-Mo Lee

Kyung-Sik Kim

Kyung Sik Kim

Byung Ik Choi

Seung Mo Lee

Jae Gu Kim

Sung Uk Yoon

Choong Man Moon

A carrier substrate includes a base layer, an antireflection layer, and an energy absorption layer, wherein the antireflection layer is formed on one surface of the base layer and allows an elastic wave generated by a first laser beam transmitted through an element adhesively bonded to the antireflection layer to be transmitted through the base layer without being reflected towards the element, the first laser beam being applied to the element through a source substrate of the element, and the energy absorption layer is formed between the base layer and the antireflection layer to be aligned with the element, and evaporates upon energy absorption.

Carrier substrate and element transfer method using the same

Provided are a graphene preparation apparatus, including: a chamber having a space for preparation of graphene; a first electrode and a second electrode disposed in the chamber to be separated a predetermined distance from each other, the first electrode and the second electrode supporting a catalytic metal and receiving electric current for preparation of the graphene to heat the catalytic metal using Joule heating; additional heaters disposed at opposite sides of the catalytic metal, respectively, and heating the catalytic metal to compensate for a temperature difference between both end regions and a central region of the catalytic metal heated using Joule heating induced by the first electrode and the second electrode; and a current supply unit supplying electric current to the first electrode and the second electrode.

Graphene preparation apparatus using Joule heating and preparation method therefor

An exemplary embodiment of the present invention provides a method of transferring a micro device. The method of transferring the micro device includes: separating a transferring film from a micro device transferred to a target substrate and bending the transferring film upwardly to form a bent circular arc, and pressurizing an upper transferring film fed after the bent circular arc is formed by a pressurizing roller rotating at an upper side of the target substrate.

Method and apparatus for transferring micro device, and electronic product using the same

A carrier film according to an embodiment of the present invention comprises: a base film; and a first adhesive layer formed on a surface of the base film such that an element to be transferred is attached to the first adhesive layer, wherein the magnitude of force of adhesion between the element and the first adhesive layer is in proportion to the depth of press-fitting at which the element is press-fitted into the first adhesive layer.

Carrier film, element transfer method using same, and electronic product manufacturing method using element transfer method

A method for transferring a micro device, includes: a compression step in which a carrier film having a micro-device attached to an adhesive layer thereof is brought into contact with a substrate comprising a solder deposited on metal electrodes formed on the substrate and is compressed on the substrate; a first adhesive strength generation step in which the solder disposed between the micro-device and the metal electrodes is compressed in the compression step to generate first adhesive strength between the micro-device and the solder; a second adhesive generation step in which the micro-device is bonded to the adhesive layer through press-fitting in the compression step to generate second adhesive strength between the micro-device and the adhesive layer; and a release step in which the carrier film is separated from the substrate, with the micro-device adhered to the solder.

Micro device transferring method, and micro device substrate manufactured by micro device transferring method

A selective transfer roll stamp is provided which rotates on a source substrate to selectively transfer elements arranged on the source substrate. The selective transfer roller stamp includes: a roller unit rotating about an axis of rotation and including projecting portions protruding in a radial direction and recessed portions formed between neighboring projecting portions; and an adhesive layer formed on the outer circumferential surface of the roller unit and coming into contact with the elements, wherein the outer circumferential surface of the adhesive layer is made flat in a circumferential direction.

Selective transfer roll stamp

Growing community of inventors

Daejeon, South Korea

Yun Hwangbo