Shanghai Zhaoxin Semiconductor Co., Ltd.

Via Technologies, Inc.

E Ink Holdings Inc.

Via Alliance Semiconductor Co., Ltd.

Avita Corporation

Yun-Han Chen

Tsai-Sheng Chen

Nai-Shung Chang

Chang-Li Tan

Hsiu-Wen Ho

Chun-Yen Kang

Hsin-Kuan Wu

Pei-Lin Huang

Po-Chun Chuang

Hsiao-Tung Chu

Jui-Yang Huang

Sheng-Bang Ou Yang

Pi-Hao Chuang

Nasal aspirator

A contact arrangement includes a plurality of contact groups. At least one of the contact groups includes a plurality of shared contacts, a plurality of dedicated contacts, and a plurality of ground contacts. The shared contacts in a first mode or a second mode transmit signals corresponding to the first mode or the second mode. The dedicated contacts transmit the signals corresponding to the first mode and do not transmit the signals corresponding to the second mode. The ground contacts surround the shared contacts and the dedicated contacts.

Contact arrangement and electronic assembly

A contact arrangement, including multiple contacts, is provided. The contacts are staggered. Some of the contacts form at least one contact group. The at least one contact group includes a pair of first contacts and eight second contacts. The pair of first contacts is a pair of differential signal contacts. The second contacts are arranged around the pair of first contacts. Two of the second contacts are arranged along a straight line perpendicular to a connecting line of the pair of first contacts. The position distribution and electrical properties of the other six of the second contacts are symmetrical to each other relative to the straight line.

Contact arrangement, circuit board, and electronic assembly

A contact arrangement, including multiple contacts, is provided. The contacts are staggered. Some of the contacts form at least one contact group. The at least one contact group includes a first contact and six second contacts. The second contacts are arranged around the first contact. When the first contact is a power contact or a ground contact, the second contacts are signal contacts. When the first contact is a signal contact, three of the second contacts are power contacts or ground contacts and are not adjacent to each other.

A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.

Printed circuit board and semiconductor package structure

A pixel array substrate includes a substrate, first signal lines, second signal lines, active elements, pixel electrodes, selection lines, a driving unit, and metal lines. Each selection line is intersected with the first signal lines to form a first intersection and second intersections. Each selection line is electrically connected to the first signal line at the first intersection and electrically insulated to the first signal lines at the second intersections. Each selection line has a first portion and a second portion. The first portion is overlapped with the first signal line at the first intersection and separated from the second portion by a gap. The driving unit is electrically connected to the second signal lines and the first portions of the selection lines. Each metal line is overlapped with one of the gaps.

Pixel array substrate with discontinuous selection lines

A circuit board including a first patterned conductive layer and a second patterned conductive layer isolated from the first patterned conductive layer is provided. The first patterned conductive layer has first signal traces and first ground traces. The second patterned conductive layer has second signal traces and second ground traces. An orthogonal projection of the second ground trace on the first patterned conductive layer partially overlaps at least one of the first signal traces. An orthogonal projection of the first ground trace on the second patterned conductive layer partially overlaps at least one of the second signal traces. An electronic assembly including the afore-described circuit board and a chip package connected thereto is also provided.

Circuit board and electronic assembly

A ball grid array (BGA) package includes a substrate and a chip. A bottom surface of the substrate includes a central area and a marginal area. Several source balls are disposed in the central area. Several ball groups are disposed in the marginal area. Each ball group includes one ground ball and at most three signal balls. The chip is disposed on a top surface of the substrate and electrically connected to the substrate.

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Taipei, Taiwan

Yun-Han Chen