Industrial Technology Research Institute

Yun-Chuan Tu

Chen-Der Tsai

Chin-Jyi Wu

Te-Chi Wong

Chih-Wei Chen

Hann-Tsong Wang

Chin-Ching Wu

Wun-Chang Shih

Dong-Cheh Ju

Tzer-Kun Lin

Yung-Tien Peng

A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.

Method for fabricating clamping device for flexible substrate

A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.

Method for fabricating a clamping device for flexible substrate

A clamping device for a flexible substrate is provided. The clamping device includes a carrier board. The carrier board has a fixed positioning assembly and a plurality of movable positioning assemblies. The fixed positioning assembly and the movable positioning assemblies are disposed in locations that almost correspond to a plurality of through holes on the flexible substrate. The fixed positioning assembly includes a hole body with a positioning hole and a dowel pin. Each movable positioning assembly includes a hole body with a positioning hole, a plurality of curved extending arms and a dowel pin. Each curved extending arm is connected to the hole body and the carrier board and the dowel pin is inserted into the positioning hole.

Clamping device for flexible substrate

A novel gas control module switch mechanism includes a diaphragm means, a valve body, a piston means and a fastening means. The diaphragm means has a plurality of diaphragms and a seal plate sandwiched between a first and a second diaphragm. The first diaphragm has a center opening to prevent the first diaphragm from making direct sealing contact. Sealing is done through the seal plate. The seal plate is made of a soft material for obtaining improved sealing effect and longer durability. The valve body has a bulged ring around an opening plane and a bulged body ring for enhancing sealing effect when the seal plate making contact with the bulged ring.

Gas control module switch mechanism

A non-contact pick-up device is disclosed. The non-contact pick-up device mainly includes a disk, and a plurality of air nozzles on the disk. Each nozzle has an air channel; and an upper end of the channel is tilt outwards. Therefore, as a disc-shaped article is placed on the disk; air jets out from the nozzles, due to Bernoulli principle, pressure difference is formed on the disc-shaped article. Thus, due to the action of atmosphere pressure, the disc-shaped article will be clamped. The pick-up device may be used in semiconductor manufacturing process for clamping a wafer.

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Hsinchu County, Taiwan

Yun-Chuan Tu