Macronix International Co., Ltd.

Yun-Chi Yang

Tzung-Ting Han

Chin-Ta Su

Yung-Tai Hung

Chun-Fu Chen

Chin-Hsiang Lin

Chi-Tung Huang

Wei-Wen Chen

Yaw-Lin Hwang

Chen-Wei Liao

This invention provides a method for forming polysilicon by using silane with introducing hydrogen, such that polysilicon is microcrystalline. This microcrystal polysilicon can be applied to floating gate of flash memory to improve the character of flash memory.

Method for improving the performance of flash memory by using microcrystalline silicon film as a floating gate

A chemical mechanical polishing method is disclosed. The method includes forming a film on a wafer having at least one trench structure thereon; polishing the surface of the film by providing a polishing composition to provide a first polished surface; rinsing the first polished surface with a rinse composition to provide a rinsed surface; and polishing the rinsed surface by providing a second polishing composition to provide a second polished surface.

Two-step chemical mechanical polishing process

This invention provides a method for forming a microcrystalline polysilicon layer by using silane or dislane with introducing hydrogen gas. This microcrystalline polysilicon layer can be used as a floating gate of a flash memory to improve the character of the flash memory.

Method for forming a flash memory by using a microcrystalline polysilicon layer as a floating gate

The present invention is related to methods of processing a semiconductor device. A plasma vapor deposition process is used to fill a trench with an oxide layer, wherein sharp corners are formed by the oxide layer. A pre-planarization sputtering process is performed to reduce the oxide layer corner sharpness. A planarization process is performed using polishing.

Plasma assisted pre-planarization process

To improve the edge breakdown caused by edge electrical field at the tunnel oxide of high-density flash memory, a bird's beak is formed at the edge of the active region of the flash memory to prevent the corner of the tunnel oxide layer formed later on the active region from being excessively sharp, which will result in localized intense electrical field, and further lead to breakdown caused by the edge electrical field.

Method for improvement of edge breakdown caused by edge electrical field at a tunnel oxide of a high-density flash memory by a shielded bird's beak

A method for determining near-surface doping concentration is provided by utilizing surface photovoltage. A monochromatic light pulse is applied to a semiconductor substrate. When the energy of the incident light is larger than the energy gap of the semiconductor substrate, the light is absorbed by the substrate and thereby generates enough charge carriers. The carriers diffuse to the surface of the substrate and result in lowering the surface barrier, and hence, cause a shift of the surface voltage. The difference of the surface voltages, before and after the light pulse applied, is measured by using a surface photovoltage probe. Then, the doping concentration near the surface of the substrate can be determined according to the difference of the surface voltage.

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Hsin-Chu, Taiwan

Yun-Chi Yang