Toshiba Lighting & Technology Corporation

Yumiko Hayashida

Masahiro Izumi

Tomohiro Sanpei

Kiyoshi Otani

Yutaka Honda

Hiroki Tamai

Soichi Shibusawa

Shinji Nogi

Akiko Saito

Kiyoshi Nishimura

Tsuyoshi Oyaizu

Seiko Kawashima

Kozo Uemura

Shuhei Matsuda

Junya Murata

Yuiko Nakagawa

Masahiro Ogata

A light emitting module () comprises a module substrate (), a light emitting diode string (), and a sealing member (). The light emitting diode string () includes light emitting diode elements () and bonding wires () which connect the light emitting diode elements (). The light emitting diode element () has a pair of element electrodes () and has a rectangular shape extending in a direction along which the element electrodes () are aligned. The sealing member () is laminated on the module substrate () to seal the light emitting diode string (). The light emitting diode elements () are arranged at intervals in a direction crossing the direction along which the element electrodes () are aligned, and the element electrodes () with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements () between the light emitting diode elements () adjacent to each other. Each bonding wire () is obliquely wired with respect to the arrangement direction of the light emitting diode elements () to connect the element electrodes () with different polarities of the light emitting diode elements () adjacent to each other.

Light emitting module and illumination apparatus

Light-emitting modules according to the embodiments is configured by mounting a plurality of semiconductor light-emitting elements having the same light-emitting property in a closed-up manner on a substrate and sealing the closed up plurality of semiconductor light-emitting elements by a dome shaped sealing member altogether.

Light-emitting module having light-emitting elements sealed with sealing member and luminaire having same

A light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm/(m&#xb7;day&#xb7;atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

Light-emitting device and luminaire

An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

Illumination device with semiconductor light-emitting elements

Growing community of inventors

Yokosuka, Japan

Yumiko Hayashida