Asahi Glass Company, Limited

Other

Yumiko Aoki

Tsuneo Manabe

Hitoshi Onoda

Satoshi Fujimine

Naoya Wada

Kazuo Sunahara

Nobuhiro Nakamura

Masamichi Tanida

Tsuneo Ichimatsu

Kenji Tanaka

Koji Nakagawa

Satoru Takaki

Yasuko Osaki

Reo Usui

Kenichi Ebata

Kazuhiko Yamanaka

Ryohei Satoh

Michifumi Kawai

Shoichi Iwanaga

Siro Ootaki

Makoto Sato

Yu Goshima

A substrate includes an auxiliary wiring pattern formed on a first main surface of a glass substrate in a grid-like pattern arranged horizontally and vertically, and a translucent glass layer formed on a surface of the glass substrate to cover the first main surface and the auxiliary wiring pattern. Through-holes exposing the auxiliary wiring pattern are formed in a portion of the translucent glass layer formed on the auxiliary wiring pattern, in each side of each grid of the grid-like pattern at uniform intervals. The substrate may be used in an electronic device having a long-life and a high reliability in which exfoliation or deterioration of a wiring is inhibited by embedding the wiring therein while maintaining smoothness of the surface.

Substrate with through-holes for grid-like auxiliary wiring pattern

The present invention relates to an organic LED element sequentially including: a transparent substrate; a scattering layer; a first electrode; an organic layer; and a second electrode, in which the scattering layer includes a first glass material and a second glass material dispersed in the first glass material and having a different refractive index from the first glass material.

Organic LED element, glass frit for diffusion layer for use in organic LED element, and method for production of diffusion layer for use in organic LED element

A process for producing a glass substrate having a circuit pattern is disclosed. The process includes forming a thin film layer on a glass substrate and then irradiating the thin film layer with laser light to form a circuit pattern on the glass substrate; depositing a low-melting point glass having a softening point of fromto&#xb0; C. on the glass substrate having the circuit pattern formed thereon; and sintering the low-melting point glass to form a low-melting point glass layer which includes the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and which forms a compatible layer between the glass substrate and the low-melting point glass layer.

Glass substrate having circuit pattern and process for producing the same

Provided is a nonlead glass for covering an electrode, which comprises, in mol %, BO15-65%, SiO2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, LiO 1-15%, LiO+NaO+KO 2-25% and others, and which comprises ZnO 0-15%. Provided is a nonlead glass for covering an electrode, which comprises, in mol %, BO25-65%, SiO2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, LiO+NaO+KO 2-25%, AlO0-30, TiO 0-10% and ZnO 0-15%.

Glass for covering electrode

A glass for covering electrodes, which consists, as represented by mass percentage based on the following oxides, essentially of:

Glass for covering electrodes and plasma display panel

A low melting point glass for covering electrodes, which contains Cu in a content as calculated as CuO within a range of from 0.1 to 0.9% by mass percentage and which contains neither Mo or Sb.

Low melting point glass for covering electrodes, and plasma display device

A low melting point glass for covering electrodes, consisting, as represented by mass percentage based on the following oxides, essentially of:

Low melting point glass for covering electrodes, and glass ceramic composition for covering electrodes

A substrate for a plasma display panel, having electrodes and a covering material for the electrodes, provided thereon, wherein the covering material is a non-crystallizable glass having a softening point of at most 510.degree. C. and an average thermal expansion coefficient of from 70.times.10.sup.-7 to 85.times.10.sup.-7 /.degree.C. within a range of from 50 to 350.degree. C.

Substrate for a plasma display panel and low melting point glass

A water-color ink composition comprising a fusible inorganic component, an aqueous medium and an organic binder soluble and/or dispersible in the aqueous binder.

Water-color ink composition and process for forming an inorganic coating

A surface conductive paste composition to be applied to the surface of a green sheet for a cermaic substrate or to the surface of a ceramic substrate after being fired and to be then fired, the solid content of which has a composition comprising from 80 to 99.9% by weight of Au powder, from 0.1 to 20% by weight of crystallized glass frit and from 0 to 19.9% by weight of non-crystallized glas frit, provided that the total of the crystallized glass frit and the non-crystallized glass frit is at most 20% by weight, and which has a lead compound powder incorporated in an amount of from 0 to 5% by weight based on the total amount of said composition.

Conductive paste compositions and ceramic substrates

A surface conductive paste composition to be applied to the surface of a green sheet for a ceramic substrate or to the surface of a ceramic substrate after being fired and to be then fired, the solid content of which has a composition comprising from 80 to 99.9% by weight of Au powder, from 0.1 to 20% by weight of crystallized glass frit and from 0 to 19.9% by weight of non-crystallized glass frit, provided that the total of the crystallized glass frit and the non-crystallized glass frit is at most 20% by weight, and which has a lead compound powder incorporated in an amount of from 0 to 5% by weight based on the total amount of said composition.

Growing community of inventors

Tokyo, Japan

Yumiko Aoki