Mitsubishi Gas Chemical Company, Inc.

Yumi Sato

Masahiro Yamane

Daichi Miyahara

A modified polyimide resin containing a structure represented by general formula (I) below. A polyimide resin containing: a structural unit A derived from a tetracarboxylic dianhydride; and a structural unit B derived from a diamine compound, wherein the structural unit A contains a structural unit derived from a compound having a specific structure in a proportion of 60 mol % or greater.

Polyimide resin, photosensitive resin composition, resin film, and electronic device

There is provided a method for producing hydroxypivalaldehyde (HPA), including steps (i) to (iii) below in this order,  The method enables HPA to be mass-produced and the collecting ratio of HPA to be improved while selectively removing impurities other than water contained in HPA, specifically IBAL and the like. According to the method for producing HPA as mentioned above, it is possible to reduce the content of neopentyl glycol-isobutyrate, isobutylaldehyde-hydroxypivalaldehyde-acetal, and isobutylaldehyde-hydroxypivalaldehyde-aldol as specific impurities byproduced from HPA.

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Kurashiki, Japan

Yumi Sato