Renesas Electronics Corporation

Yumi Imamura

Takashi Karashima

Yosuke Imazeki

An object of the present invention is to improve the reliability of a semiconductor device having an imaging function. A semiconductor device includes a package having a cavity and terminals (TE), a semiconductor chip that has an imaging unit and is arranged in the cavity, and a cap material with which the cavity is sealed and which has translucency. In addition, the semiconductor device includes a mounting board that has a through-hole and terminals (TE) and is arranged so as to electrically couple the terminals (TE) to the terminals (TE), a heat transfer member that is inserted into the through-hole and is coupled to the package, and a heat sink coupled to the heat transfer member.

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Gunma, Japan

Yumi Imamura