Unitika Ltd.

Yumeto Fukubayashi

Akira Shigeta

Makoto Nakai

Munenori Yamada

Takatoshi Murakami

Ayumi Yanaka

The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.

Epoxy resin solution

The present invention is to provide a polyamide-imide which has a high regularity of molecular structure and few branched structures, does not contain hydrogen halide, is not required to be separated and purified in post processes, and can be suitably used as a film, a varnish, or a molding material; raw material salt of polyamide-imide and production method thereof. The polyamide-imide has a repeating unit represented by the general formula (1): in which R, Rrepresent independently a divalent residue having an aromatic ring, an aliphatic ring or an aliphatic hydrocarbon; R, Rrepresent independently a trivalent residue having an aromatic ring or an aliphatic ring; and an hydrogen atom bonding to the respective rings may be replaced by another atom or an atomic group.

Polyamide-imide, raw material salt of polyamide-imide, and production method thereof

An object of the present invention is to provide an industrially advantageous method for producing a bisimide dicarboxylic acid, which uses substantially no solvent and requires no granulation after completion of the reaction. The above object can be achieved by a method for producing a bisimide dicarboxylic acid with a tricarboxylic acid anhydride and a diamine, including the following processes (i) and (ii):

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Uji, Japan

Yumeto Fukubayashi