Tdk Corporation

Yuma Ishikawa

Hidekazu Sato

Shinichi Sato

Akihiko Oide

Yohei Tadaki

Makoto Yoshino

Kazuhiro Ebina

Hiroyuki Tanoue

Takashi Endo

Yoji Tozawa

Kazuma Takahashi

Masashi Shimoyasu

Hidenobu Umeda

Keigo Higashida

Takuo Hattori

Takuo Abe

An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

Electronic component

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

A multilayer coil component includes an element body made of a ferrite sintered body and a coil. The coil is configured with a plurality of internal conductors juxtaposed in the element body and electrically connected to one another. An average crystal grain size in a surface region of the element body is smaller than an average crystal grain size in a region between the internal conductors in the element body. A surface of the element body is covered with a layer made of an insulating material. The insulating material is not present among the crystal grains in the surface region of the element body.

Multilayer coil component

A second coil opposes a first coil in a first direction. The first and second coils are positioned between a first conductor and a second conductor in the first direction. The first conductor is adjacent to the first coil in the first direction and overlaps a part of the first coil when viewed from the first direction. The second conductor is adjacent to the second coil in the first direction and overlaps a part of the second coil when viewed from the first direction. The first and second conductors are of a shape extending in a line. Inner regions of the first and second coils include regions not overlapping the first and second conductors when viewed from the first direction.

Multilayer common mode filter

An ESD protection component includes opposite electrodes and a ground electrode. The opposite electrodes and the ground electrode each have an extraction portion and an opposite portion. The respective opposite portions of the opposite electrodes and the ground electrode are placed on the same layer. At least one of the opposite electrodes and the ground electrode, the extraction portion and the opposite portion are placed on respective different layers and, also, are electrically connected to each other via a through hole conductor.

ESD protection component

An ESD suppressor is configured including first and second discharge electrodes arranged as separated from each other, and a discharge inducing portion kept in contact with the first and second discharge electrodes so as to connect mutually opposed portions of the first and second discharge electrodes to each other. The discharge inducing portion contains metal particles. The first and second discharge electrodes are located on the coil side with respect to the discharge inducing portion when viewed in a stack direction of a plurality of insulator layers. An element body has a cavity portion located so as to cover the whole of the discharge inducing portion when viewed in the stack direction from the coil side. The cavity portion is in contact with the mutually opposed portions of the first and second discharge electrodes and with the discharge inducing portion.

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Tokyo, Japan

Yuma Ishikawa